Solar cell panel
View Patent ↗Disclosed is a solar cell panel including a plurality of solar cells each including a semiconductor substrate and an electrode formed on the semiconductor substrate, and a wire for interconnecting the solar cells. The electrode includes a bus-bar line having a pad portion for attachment of the wire. The wire includes a first wire portion connected to the pad portion, and a second wire portion located on a portion excluding the pad portion. The first wire portion has a thickness greater than a thickness of the second wire portion.
1. A solar cell panel comprising:
a plurality of solar cells each including a semiconductor substrate and an electrode formed on the semiconductor substrate; and
a wire for interconnecting at least two of the plurality of solar cells,
wherein the electrode includes a bus-bar line having a pad portion for attachment of the wire,
wherein the wire includes a first wire portion connected to the pad portion, and a second wire portion located on a portion of the bus-bar line excluding the pad portion,
wherein the first wire portion has a thickness greater than a thickness of the second wire portion, and
wherein the first wire portion close to each of the plurality of solar cells has a width greater than a width of the second wire portion close to each of the plurality of solar cells.
2. The solar cell panel according to claim 1 , wherein a ratio of the thickness of the second wire portion to the thickness of the first wire portion ranges from 1:1.05 to 1:1.5.
3. The solar cell panel according to claim 1 , wherein the thickness of the first wire portion is less than a width of the first wire portion close to the pad portion.
4. The solar cell panel according to claim 3 , wherein a ratio of the width of the first wire portion close to the pad portion to the thickness of the first wire portion ranges from 1:0.3 to 1:0.6.
5. The solar cell panel according to claim 1 , wherein the wire includes a core layer and a solder layer disposed on an outer surface of the core layer, and
wherein the solder layer of the first wire portion has a thickness greater than a thickness of the solder layer of the second wire portion.
6. The solar cell panel according to claim 5 , wherein the solder layer is not provided in the first wire portion between the core layer and the pad portion, or the solder layer includes a lower portion located between the core layer and the pad portion and an upper portion located distant from the solar cells, a thickness of the lower portion being less than a thickness of the upper portion.
7. The solar cell panel according to claim 5 , wherein the solder layer of the first wire portion includes an upper portion located distant from the solar cells, the solder layer of the second wire portion includes an upper portion located distant from the solar cells, and the upper portion of the solder layer of the first wire portion has a thickness greater than a thickness of the upper portion of the solder layer of the second wire portion.
8. The solar cell panel according to claim 5 , wherein the core layer has a circular or elliptical cross-sectional shape.
9. The solar cell panel according to claim 5 , wherein the core layer has a width ranging from 250 μm to 500 μm,
wherein the thickness of the first wire portion ranges from 265.5 μm to 870 μm, and
wherein the thickness of the second wire portion ranges from 250 μm to 580 μm.
10. The solar cell panel according to claim 1 , wherein the first wire portion is gradually increased in width, in a portion thereof close to the solar cells, with decreasing distance to the solar cells, and
wherein the second wire portion is gradually reduced in width, in a portion thereof close to the solar cells, with decreasing distance to the solar cells.
11. The solar cell panel according to claim 1 , wherein, in a cross-section of the first wire portion perpendicular to a longitudinal direction, an inflection point is located between a portion located distant from the solar cells and a portion located close to the solar cells.
12. The solar cell panel according to claim 1 , wherein, in a cross-section of the first wire portion perpendicular to a longitudinal direction, a portion located distant from the solar cells has an outwardly convexly curved outer surface.
13. The solar cell panel according to claim 12 , wherein, in the cross-section of the first wire portion perpendicular to the longitudinal direction, the portion located distant from the solar cells has a semicircular or semielliptical shape.
14. The solar cell panel according to claim 1 , wherein the width of the second wire portion close to the solar cells is 36% or less of the width of the first wire portion close to the solar cells.
15. The solar cell panel according to claim 1 , wherein the electrode further includes a line portion having a smaller width than the pad portion,
wherein the second wire portion is located over the line portion,
wherein the wire includes a core layer and a solder layer disposed on an outer surface of the core layer, and
wherein the core layer has a diameter greater than the width of the line portion.
16. The solar cell panel according to claim 15 , wherein the first wire portion close to the solar cells has a width equal to or less than the width of the pad portion and greater than the width of the line portion.
17. The solar cell panel according to claim 15 , wherein the second wire portion close to the solar cells has a width equal to or less than the width of the line portion.
18. The solar cell panel according to claim 15 , wherein the width of the line portion is below 490 μm, and
wherein the width of the pad portion ranges from 0.5 mm to 2 mm.
19. The solar cell panel according to claim 1 , wherein the wire is provided in a number ranging from six to thirty-three on one surface of each solar cell.
20. A solar cell panel comprising:
a plurality of solar cells each including a semiconductor substrate and an electrode formed on the semiconductor substrate; and
a wire for interconnecting at least two of the plurality of solar cells,
wherein the electrode includes a bus-bar line having a pad portion for attachment of the wire,
wherein the wire includes a first wire portion connected to the pad portion, and a second wire portion located on a portion of the bus-bar line excluding the pad portion,
wherein the first wire portion has a thickness greater than a thickness of the second wire portion,
wherein the wire includes a core layer and a solder layer disposed on an outer surface of the core layer, and
wherein the solder layer of the first wire portion has a thickness greater than a thickness of the solder layer of the second wire portion.