IP Library Granted Patent US 10,475,945
Granted Patent B2
US 10,475,945 · App. 15/230,191 · Granted Nov 12, 2019

Front contact solar cell with formed electrically conducting layers on the front side and backside

Inventor: Peter John Cousins (Menlo Park, CA)
Assignee: SunPower Corporation
H01L31/0682H01L31/02168H01L31/02363H01L31/022433H01L31/03682H01L31/056H01L31/072H01L31/0745H01L31/182H01L31/1804Y02E10/52Y02E10/546Y02E10/547Y02P70/521
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Quick Facts
Patent No.
US 10,475,945
App. No.
15/230,191
Granted
Nov 12, 2019
Kind
B2
Abstract

A bipolar solar cell includes a backside junction formed by a silicon substrate and a first doped layer of a first dopant type on the backside of the solar cell. A second doped layer of a second dopant type makes an electrical connection to the substrate from the front side of the solar cell. A first metal contact of a first electrical polarity electrically connects to the first doped layer on the backside of the solar cell, and a second metal contact of a second electrical polarity electrically connects to the second doped layer on the front side of the solar cell. An external electrical circuit may be electrically connected to the first and second metal contacts to be powered by the solar cell.

Claims (51)

1. A method of fabricating a solar cell having a front side facing the sun to collect solar radiation during normal operation and a backside opposite the front side, the method comprising:

forming a first layer of material over a back surface of an N-type silicon substrate on the backside of the solar cell;

forming a first dopant source layer comprising P-type dopants over the first layer of material;

forming a second layer of material over a front surface of the N-type silicon substrate on the front side of the solar cell;

forming a second dopant source layer comprising N-type dopants over the second layer of material;

diffusing P-type dopants from the first dopant source layer to the first layer of material to form a backside junction with the silicon substrate;

diffusing N-type dopants from the second dopant source layer to the second layer of material; and

forming a first capping layer over the first dopant source layer and a second capping layer over the second dopant source layer prior to diffusing dopants from the first dopant source layer and the second dopant source layer.

2. The method of claim 1 , wherein the first dopant source layer comprises borosilicate glass.

3. The method of claim 1 , wherein the second dopant source layer comprises phosphosilicate glass.

4. The method of claim 1 , wherein the first and second layers of material comprise polysilicon.

5. The method of claim 1 , further comprising:

texturing the front surface of the N-type silicon substrate; and

forming an antireflective layer over the textured front surface of the N-type silicon substrate.

6. The method of claim 5 , wherein the antireflective layer comprises silicon nitride.

7. The method of claim 1 , wherein the diffusion of the P-type dopants from the first dopant source layer to the first layer of material and the diffusion of the N-type dopants from the second dopant source layer to the second layer of material are performed in situ.

8. A method of fabricating a solar cell, the method comprising:

forming a first polysilicon layer over a back surface of a silicon substrate on a backside of the solar cell;

forming a first dopant source layer comprising dopants of a first conductivity type over the first polysilicon layer;

forming a second polysilicon layer over a front surface of the silicon substrate on a front side of the solar cell, the front surface of the silicon substrate being configured to face the sun during normal operation;

forming a second dopant source layer comprising dopants of a second conductivity type that is opposite the first conductivity type over the second polysilicon layer;

diffusing dopants from the first dopant source layer to the first polysilicon layer to foil a backside junction with the silicon substrate;

diffusing dopants from the second dopant source layer to the second polysilicon layer; and

forming a first capping layer over the first dopant source layer and a second capping layer over the second dopant source layer prior to diffusing dopants from the first dopant source layer and the second dopant source layer.

9. The method of claim 8 , further comprising:

forming a first thin dielectric layer between the back surface of the silicon substrate and the first polysilicon layer; and

forming a second thin dielectric layer between the front surface of the silicon substrate and the second polysilicon layer.

10. The method of claim 9 , wherein the first thin dielectric layer and the second thin dielectric layer comprise thermally grown silicon dioxide.

11. The method of claim 8 , wherein the first dopant source layer comprises borosilicate glass.

12. The method of claim 8 , wherein the second dopant source layer comprises phosphosilicate glass.

13. The method of claim 8 , further comprising:

texturing the front surface of the silicon substrate; and

forming an antireflective layer over the textured front surface of the silicon substrate.

14. The method of claim 13 , wherein the antireflective layer comprises silicon nitride.

15. A method of fabricating a solar cell, the method comprising:

forming a first silicon dioxide layer over a back surface of a silicon substrate;

forming a first polysilicon layer over the first silicon dioxide layer;

forming a first dopant source layer over the first polysilicon layer;

forming a second silicon dioxide layer over a front surface of the silicon substrate;

forming a second polysilicon layer over the second silicon dioxide layer, the front surface of the silicon substrate being configured to face the sun during normal operation;

forming a second dopant source layer over the second polysilicon layer;

diffusing dopants of a first conductivity type from the first dopant source layer to the first polysilicon layer to form a backside junction with the silicon substrate;

diffusing dopants of a second conductivity type from the second dopant source layer to the second polysilicon layer; and

forming a first capping layer over the first dopant source layer and a second capping layer over the second dopant source layer prior to diffusing dopants from the first dopant source layer and the second dopant source layer.

16. The method of claim 15 , further comprising:

texturing the front surface of the silicon substrate.

17. The method of claim 16 , further comprising:

forming an antireflective layer over the textured front surface of the silicon substrate.

18. The method of claim 15 , wherein forming the first dopant source layer over the first polysilicon layer comprises forming a P-type dopant source layer.

19. The method of claim 15 , wherein forming the second dopant source layer over the second polysilicon layer comprises forming an N-type dopant source layer.

20. The method of claim 15 , wherein the silicon substrate is an N-type silicon substrate.

Assignments (4)
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: SUNPOWER CORPORATION
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 062490/0742 →