Semiconductor device and manufacturing method of semiconductor device

1. A semiconductor device, comprising:

an oxide semiconductor layer;

a gate electrode facing the oxide semiconductor layer;

a gate insulating layer between the oxide semiconductor layer and the gate electrode;

a first barrier layer below the oxide semiconductor layer;

a second barrier layer above the oxide semiconductor layer, the second barrier layer covering a top surface and side surfaces of the oxide semiconductor layer and being in contact with the first barrier layer in a region around the oxide semiconductor layer;

a first oxide layer between the oxide semiconductor layer and the first barrier layer; and

a second oxide layer between the oxide semiconductor layer and the second barrier layer,

wherein the first barrier layer and the second barrier layer contain nitrogen.

2. The semiconductor device according to claim 1 , wherein:

the gate electrode is below the oxide semiconductor layer; and

the gate insulating layer includes the first barrier layer and the first oxide layer.

3. The semiconductor device according to claim 2 , wherein:

the first oxide layer has substantially the same pattern as that of the oxide semiconductor layer as seen in a plan view; and

a region of the first barrier layer exposed from the first oxide layer is thinner than a region of the first barrier layer below the first oxide layer.

4. The semiconductor device according to claim 2 , further comprising a source electrode and a drain electrode between the second oxide layer and the second barrier layer, the source electrode and the drain electrode being connected with the oxide semiconductor layer.

5. The semiconductor device according to claim 1 , wherein:

the gate electrode is above the oxide semiconductor layer; and

the gate insulating layer includes the second oxide layer.

6. The semiconductor device according to claim 5 , wherein the second barrier layer is above the oxide semiconductor layer, the gate insulating layer and the gate electrode.

7. The semiconductor device according to claim 6 , wherein a region of the oxide semiconductor layer exposed from the second oxide layer is in contact with the second barrier layer.

8. The semiconductor device according to claim 7 , wherein the region of the oxide semiconductor layer exposed from the second oxide layer has a resistivity lower than that of a region of the oxide semiconductor layer below the second oxide layer.

9. The semiconductor device according to claim 6 , wherein:

the first oxide layer has substantially the same pattern as that of the oxide semiconductor layer as seen in a plan view; and

a region of the first barrier layer exposed from the first oxide layer is thinner than a region of the first barrier layer below the first oxide layer.

10. The semiconductor device according to claim 6 , further comprising a source electrode and a drain electrode respectively connected with a source region and a drain region of the oxide semiconductor layer;

wherein:

the second barrier layer has openings reaching the source region and the drain region; and

the source electrode and the drain electrode are in the openings.

11. A manufacturing method of a semiconductor device, comprising:

forming a first barrier layer;

forming a first oxide layer above the first barrier layer;

forming an oxide semiconductor layer above the first oxide layer;

performing fluorine etching using fluorine-containing gas on a region of the first oxide layer exposed from the oxide semiconductor layer to expose a region of the first barrier layer;

forming a second oxide layer above the oxide semiconductor layer, the second oxide layer partially exposing the oxide semiconductor layer; and

forming a second barrier layer in contact with the exposed region of the first barrier layer in a region surrounding the oxide semiconductor layer.

12. A manufacturing method of a semiconductor device, comprising:

forming a first barrier layer;

forming a first oxide layer above the first barrier layer;

forming an oxide semiconductor layer above the first oxide layer;

forming a second oxide layer above the oxide semiconductor layer;

performing fluorine etching using fluorine-containing gas on a region of the second oxide layer exposed from a mask partially covering the oxide semiconductor layer and on a region of the first oxide layer exposed from the oxide semiconductor layer to expose a region of the first barrier layer; and

forming a second barrier layer in contact with the exposed region of the first barrier layer in a region surrounding the oxide semiconductor layer.

13. The manufacturing method of a semiconductor device according to claim 11 , wherein the exposed region of the first barrier layer is over-etched by the fluorine etching.

14. The manufacturing method of a semiconductor device according to claim 11 , further comprising forming a gate electrode;

wherein the first barrier layer is formed above the gate electrode.

15. The manufacturing method of a semiconductor device according to claim 14 , further comprising:

forming a conductive layer above the second oxide layer; and

etching the conductive layer by use of the second oxide layer as an etching stopper to form a source electrode and a drain electrode;

wherein:

the second oxide layer is formed to cover a region of the oxide semiconductor layer to be a channel; and

the second barrier layer is formed above the source electrode and the drain electrode.

16. The manufacturing method of a semiconductor device according to claim 11 , further comprising forming a gate electrode above the second oxide layer;

wherein the second barrier layer is formed above the gate electrode.

17. The manufacturing method of a semiconductor device according to claim 11 , further comprising:

forming a gate electrode above the second oxide layer; and

performing the fluorine etching on a region of the first oxide layer exposed from the oxide semiconductor layer to expose the first barrier layer.

18. The manufacturing method of a semiconductor device according to claim 16 , further comprising:

forming openings in the second barrier layer, the openings reaching a source region and a drain region of the oxide semiconductor layer; and

forming a source electrode and a drain electrode in the openings, the source electrode and the drain electrode being connected with the oxide semiconductor layer.