Fabrication of correlated electron material film via exposure to ultraviolet energy
Subject matter disclosed herein may relate to fabrication of correlated electron materials used, for example, to perform a switching function. In embodiments, processes are described, in which an ultraviolet light source is utilized during fabrication of a correlated electron material. In embodiments, use of ultraviolet light may decrease a likelihood of diffusion of atomic and/or molecular components of a substrate that may bring about undesirable electrical performance of a CEM device.
1. A method of constructing a device, comprising:
forming a substrate from a first material; and
forming, in a chamber, one or more layers of correlated electron material (CEM) on the substrate via an atomic layer deposition process comprising a plurality of individual cycles, wherein forming at least one of the one or more layers in an individual cycle of the plurality of individual cycles comprises:
purging the chamber of at least a portion of a particular precursor gas used in forming at least one layer of the one or more layers of CEM; and
following initiation of the purging, commencing exposure of the at least one layer of the one or more layers of CEM to a light source having predominantly ultraviolet frequency content prior to a flooding of the chamber with a subsequent precursor gas in a subsequent cycle of the plurality of individual cycles.
2. The method of claim 1 , wherein the at least one layer of the one or more layers of CEM comprises a thickness of about 0.6 Å to about 5.0 Å.
3. The method of claim 1 , wherein the particular precursor gas comprises nickel amidinate (Ni(AMD)), nickel dicyclopentadienyl (Ni(Cp) 2 ), nickel diethylcyclopentadienyl (Ni(EtCp) 2 ), Bis(2,2,6,6-tetramethylheptane-3,5-dionato)Ni(II) (Ni(thd) 2 ), nickel acetylacetonate (Ni(acac) 2 ), bis(methylcyclopentadienyl)nickel (Ni(CH 3 C 5 H4) 2 ), nickel dimethylglyoximate (Ni(dmg)2), nickel 2-amino-pent-2-en-4-onato (Ni(apo) 2 ), Ni(dmamb) 2 (in which dmamb=1-dimethylamino-2-methyl-2-butanolate), Ni(dmamp) 2 (in which dmamp=1-dimethylamino-2-methyl-2-propanolate), Bis(pentamethylcyclopentadienyl)nickel (Ni(C 5 (CH 3 ) 5 ) 2 ) or nickel carbonyl (Ni(CO) 4 ), or any combination thereof, in a gaseous state.
4. The method of claim 2 , wherein the light source emits a substantial portion of energy at a wavelength of approximately 253.7 nm and 184.9 nm.
5. The method of claim 2 , further comprising:
maintaining the chamber at a temperature of between about 20.0° C. and about 400.0° C.
6. The method of claim 1 , wherein the atomic layer deposition process utilizes at least the particular precursor gas and the subsequent precursor gas to deposit components of NiO:CO over the substrate.
7. The method of claim 1 , wherein the atomic layer deposition process utilizes at least the particular precursor gas and the subsequent precursor gas to deposit components of NiO:NH 3 onto the substrate.
8. The method of claim 1 , wherein forming the one or more layers of CEM comprises a thermally-sensitive portion, the thermally-sensitive portion occurring at a chamber temperature of less than 400.0° C.
9. The method of claim 1 , wherein the light source having predominantly ultraviolet frequency content comprises a light source emitting energy, wherein at least 50% of the emitted energy comprises energy at wavelengths of between approximately 100.0 nm and 450.0 nm.
10. A method of constructing a device, comprising:
in a chamber, forming, via an atomic layer deposition process comprising a plurality of individual cycles, one or more layers of correlated electron material (CEM) on a substrate formed from a first material, wherein forming at least one layer of the one or more layers in an individual cycle of the plurality of individual cycles comprises exposing one or more particular chemical precursors of the CEM to a light source having predominantly ultraviolet frequency content, the exposing following purging the chamber of at least a portion of a gaseous precursor prior to a flooding of the chamber with one or more subsequent chemical precursors in a subsequent cycle of the plurality of individual cycles; and
maintaining a temperature of the chamber that does not exceed 400.0° C. during the forming the one or more layers of CEM.
11. The method of claim 10 , wherein the at least one layer of the one or more layers of CEM comprises a thickness of about 0.6 Å to about 5.0 Å.
12. The method of claim 11 , wherein the one or more particular chemical precursors comprises nickel amidinate (Ni(AMD)), nickel dicyclopentadienyl (Ni(Cp) 2 ), nickeldiethylcyclopentadienyl (Ni(EtCp) 2 ), Bis(2,2,6,6-tetramethylheptane-3,5-dionato)Ni(II) (Ni(thd) 2 ), nickel acetylacetonate (Ni(acac) 2 ), bis(methylcyclopentadienyl)nickel (Ni(CH 3 C 5 H4) 2 ), nickel dimethylglyoximate (Ni(dmg)2), nickel 2-amino-pent-2-en-4-onato (Ni(apo) 2 ), Ni(dmamb) 2 (in which dmamb=1-dimethylamino-2-methyl-2-butanolate), Ni(dmamp) 2 (in which dmamp=1-dimethylamino-2-methyl-2-propanolate), Bis(pentamethylcyclopentadienyl)nickel (Ni(C 5 (CH 3 ) 5 ) 2 ) or nickel carbonyl (Ni(CO) 4 ), or any combination thereof, in a gaseous state.
13. The method of claim 11 , wherein the light source emits a substantial portion of energy at a wavelength of approximately 253.7 nm and 184.9 nm.
14. The method of claim 11 , further comprising:
maintaining the chamber at a temperature between about 20.0° C. and about 400.0° C.
15. The method of claim 10 , wherein the atomic layer deposition processes utilizes at least the one or more particular chemical precursors and the one or more subsequent chemical precursors to deposit components of NiO:CO over the substrate.
16. The method of claim 10 , wherein the atomic layer deposition process utilizes at least the one or more particular chemical precursors and the one or more subsequent chemical precursors to deposit components of NiO:NH 3 onto the conductive substrate.
17. A method of fabricating a device, comprising:
flowing one or more chemical precursors of a correlated electron material (CEM) into a process chamber during an individual cycle of a plurality of individual cycles of an atomic layer deposition process; and
exposing, following purging of the process chamber of at least a portion of a particular precursor gas used in forming at least one layer of one or more layers in an individual cycle of the plurality of individual cycles, one or more layers of the CEM to a light source having a predominantly ultraviolet frequency content prior to a flooding of the chamber with a subsequent precursor gas in a subsequent cycle of the plurality of individual cycles.
18. The method of claim 17 , further comprising:
forming a substrate prior to the flowing of the one or more chemical precursors of the CEM, the CEM being formed on one or more layers of the substrate.
19. The method of claim 17 , further comprising:
maintaining a temperature of the process chamber below 400.0° C.
20. The method of claim 17 , wherein the flowing the one or more chemical precursors comprises flowing nickel amidinate (Ni(AMD)), nickel dicyclopentadienyl (Ni(Cp) 2 ), nickel diethylcyclopentadienyl (Ni(EtCp) 2 ), Bis(2,2,6,6-tetramethylheptane-3,5-dionato)Ni(II) (Ni(thd) 2 ), nickel acetylacetonate (Ni(acac) 2 ), bis(methylcyclopentadienyl)nickel (Ni(CH 3 C 5 H4) 2 ), nickel dimethylglyoximate (Ni(dmg)2), nickel 2-amino-pent-2-en-4-onato (Ni(apo) 2 ), Ni(dmamb) 2 (in which dmamb=1-dimethylamino-2-methyl-2-butanolate), Ni(dmamp) 2 (in which dmamp=1-dimethylamino-2-methyl-2-propanolate), Bis(pentamethylcyclopentadienyl)nickel (Ni(C 5 (CH 3 ) 5 ) 2 ) or nickel carbonyl (Ni(CO) 4 ), or any combination thereof, in a gaseous state.
21. The method of claim 17 , wherein the at least one layer of the one or more layers of the CEM comprises a thickness of about 0.6 Å to about 5.0 Å.