IP Library Granted Patent US 10,474,207
Granted Patent B2
US 10,474,207 · App. 15/242,167 · Granted Nov 12, 2019

Carbon fiber laminate piezoelectric cooler and method therefor

Inventors: Joohyun Woo (Austin, TX); Deeder M. Aurongzeb (Austin, TX)
Assignee: DELL PRODUCTS, LP
G06F1/203F04D33/00G01K13/00G06F1/206G06F1/26G06F11/327H01L23/467H01L2924/0002
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Quick Facts
Patent No.
US 10,474,207
App. No.
15/242,167
Granted
Nov 12, 2019
Kind
B2
Abstract

An opening at a first carbon fiber sheet is provided, the opening extending through the sheet from a first major surface to a second major surface, the opening defining two sides and a first end of a rectangular flap, a second end of the flap remaining rooted in the first carbon fiber sheet. A piezoelectric transducer is bonded to the first carbon fiber sheet, the transducer proximate to the second end of the flap. A controller including a signal generator is coupled to the piezoelectric transducer, the piezoelectric transducer to excite sympathetic vibration of the flap.

Claims (36)

1. An apparatus comprising:

an array of fins, each fin formed at a surface of a heat conducting material, at least three sides of each fin defined by a machined opening extending into a major surface of the material, a base of each fin remaining rooted in the material; and

a piezoelectric transducer bonded to the heat conducting material adjacent to the array of fins, the fins to vibrate in response to and in sympathy with vibration of the piezoelectric transducer, vibration of the transducer in response to being energized by a signal having a first frequency.

2. The apparatus of claim 1 , wherein:

the opening descends at an acute angle relative to the first major surface of the heat conducting material; and

the fin defined by the opening is manipulated during manufacture in a direction that is perpendicular to the major surface.

3. The apparatus of claim 2 , wherein a first fin of the array of fins is manipulated to be perpendicular to the major surface of the heat conducting material, and a second fin of the array adjacent to the first fin is manipulated to be less than perpendicular to the major surface.

4. The apparatus of claim 3 , wherein the first and second fins being non-parallel stimulate air flow by creating localized regions of non-uniform air pressure.

5. The apparatus of claim 1 , further comprising:

a controller including a signal generator coupled to the piezoelectric element, the controller to control the piezoelectric transducer to excite sympathetic vibration of each fin of the array.

6. The apparatus of claim 1 , further comprising:

an airflow sensor; and

a controller coupled to the piezoelectric transducer, the controller to regulate operation of the piezoelectric transducer based on information provided by the airflow sensor.

7. The apparatus of claim 1 , further comprising:

a memory device to store a cooling profile associating an operating configuration of the piezoelectric transducer with a first application program executing at the information handling system; and

a controller coupled to the piezoelectric transducer and to the memory device, the controller to regulate operation of the piezoelectric transducer based on the cooling profile.

8. The apparatus of claim 1 , wherein the heat conducting material is a carbon fiber composite.

9. The apparatus of claim 1 , wherein the piezoelectric transducer is a discrete component in proximity to the array of fins and not in intimate contact with any fin of the array of fins.

10. The apparatus of claim 1 , wherein the heat conducting material is aluminum bonded to a carbon fiber composite.

11. The apparatus of claim 1 , wherein the array of fins extend in one direction parallel with the major surface of the heat conducting material.

12. The apparatus of claim 1 , wherein fins of the array of fins extend in two directions parallel with the major surface of the heat conducting material.

13. A method comprising:

machining openings at a heat conducting material to define at least three side portions of each fin of an array of fins, the openings extending into a major surface of the material, a base of each fin remaining rooted in the material;

providing a piezoelectric transducer bonded to the heat conducting material, the transducer adjacent to the array of fins, the piezoelectric transducer being a discrete component that is not in intimate contact with any fin of the array of fins; and

providing a controller including a signal generator coupled to the piezoelectric transducer, a signal provided by the signal generator causing the piezoelectric transducer to vibrate and excite sympathetic vibration of each fin.

14. The method of claim 13 , further comprising:

manipulating a first fin of the array to be perpendicular to the major surface of the heat conducting material; and

manipulating a second fin of the array adjacent to the first fin to be less than perpendicular to the major surface, wherein the first and second fins being non-parallel stimulate air flow by creating localized regions of non-uniform air pressure.

15. The method of claim 13 , wherein the controller is further configured to regulate operation of the piezoelectric transducer based on vibration information provided by a vibration sensor located adjacent to the array of fins.

16. The method of claim 13 , wherein the controller is further configured to regulate operation of the piezoelectric transducer based on a cooling profile associating an operating configuration of the piezoelectric transducer with a first application program executing at an information handling system including the array of fins.

17. The method of claim 13 , wherein the array of fins is included at an exhaust vent of an information handling system.

18. The method of claim 13 , wherein the array of fins is included at an intake vent of an information handling system.

19. The method of claim 13 , wherein the array of fins are included at a heat sink coupled to a heat generating component at an information handling system.

20. An information handling system comprising:

an array of fins, each fin formed at a surface of a heat conducting material, at least three sides of each fin defined by a machined opening extending into a major surface of the material, a base of each fin remaining rooted in the material; and

a piezoelectric transducer bonded to the heat conducting material adjacent to the array of fins, the fins to vibrate in response to and in sympathy with the piezoelectric transducer when the transducer is energized by a signal having a first frequency, wherein the piezoelectric transducer is not in intimate contact with any fin of the array of fins.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040679/0386) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 059803/0666 →
RELEASE OF SECURITY INTEREST AT REEL 040633 FRAME 0799 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL INTERNATIONAL, L.L.C.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.; EMC CORPORATION
Reel/Frame 058297/0427 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Nov 23, 2016
From: DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.; EMC CORPORATION
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 040679/0386 →
SECURITY INTEREST Recorded Nov 16, 2016
From: DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; WYSE TECHNOLOGY L.L.C.; EMC CORPORATION
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040633/0799 →
Continuity (2)
Continuation 14460974 · Aug 15, 2014
Related Publication 20160357230A1 · Dec 8, 2016