IP Library Patent Application 15242770
Patent Application
App. No. 15/242,770

ADDITIVE MANUFACTURING

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Quick Facts
Patent No.
US None
App. No.
15/242,770
Abstract

A method is for removing a support structure from an additive manufactured metallic component. The method includes exposing the component and support structure to at least one thermal pulse so as to weaken, or break, the interface(s) between the support structure and component prior to removal of the support.

Claims (17)

1 . A method of removing a support structure from an additive manufactured metallic component, the method comprising exposing the component and support structure to at least one thermal pulse so as to weaken, or break, the interface(s) between the support structure and component prior to removal of the support.

2 . The method of claim 1 , wherein the support comprises a bulk support and the interface comprises a plurality of interface support members connecting between the bulk support and the component and wherein the interface support members are weakened by the thermal pulse prior to the removal of the bulk support by any other method.

3 . The method of claim 1 , wherein the thermal pulse is at a temperature exceeding the melting point of the metallic material.

4 . The method of claim 1 , wherein the step of exposing the component and support structure to a thermal pulse comprises placing the component and support structure in a chamber, filling the chamber with a combustible gas mixture, allowing the gas mixture to surround the component and support structure and igniting the gas mixture.

5 . The method of claim 4 , wherein the thermal pulse is an explosive or pseudo-explosive combustion.

6 . A method of additive manufacturing metallic components, the method comprising the steps of:

forming a component in a layer-by-layer process, the component being formed integrally with at least one support structure to be separated from the component after the layer-by-layer process; and wherein after completion of the layer-by-layer process, the method comprises removal of the support structure from the additive manufactured metal component in accordance with claim 1 .

7 . The method of claim 6 , wherein the metallic component and support structure is formed on a baseplate and prior to the removal of the support structure from the additive manufactured metallic component the method further comprises the steps of:

heat treating the metallic component and the support structure to remove or reduce residual stresses induced the layer-by-layer process;

and subsequently removing the component and support structure from the base plate.

8 . The method of claim 1 , wherein after mechanical removal of the support structure from the metallic component, at least one further thermal pulse is applied to the separated metallic component.

9 . The method of claim 8 , wherein a plurality of thermal pulses are applied to the separated metallic component.

10 . The method of claim 8 , wherein the surface of the metallic component is abrasively cleaned after the application of at least one thermal pulse to the separated metallic component.

11 . The method of claim 1 , wherein the additive manufacturing process comprises powder bed selective laser manufacturing.

12 . The method of claim 6 , wherein after mechanical removal of the support structure from the metallic component, at least one further thermal pulse is applied to the separated metallic component.

13 . The method of claim 12 , wherein a plurality of thermal pulses are applied to the separated metallic component.

14 . The method of claim 13 , wherein the surface of the metallic component is abrasively cleaned after the application of at least one thermal pulse to the separated metallic component.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2021
From: SIEMENS AKTIENGESELLSCHAFT
To: SIEMENS ENERGY GLOBAL GMBH & CO. KG
Reel/Frame 055615/0389 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2018
From: MATERIALS SOLUTIONS LIMITED
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 045971/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2018
From: MATERIALS SOLUTIONS LIMITED, UK
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 045037/0441 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2018
From: ILLSTON, TREVOR JOHN; VORA, PRATIK YATIN
To: MATERIALS SOLUTIONS LIMITED
Reel/Frame 044541/0168 →