IP Library › Patent Application 15242955
Patent Application
App. No. 15/242,955

High-Dielectric Compositions for Particle Formation and Methods of Forming Particles Using Same

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Quick Facts
Patent No.
US None
App. No.
15/242,955
Abstract

A high dielectric contrast composition for particle formation that includes a high dielectric solvent, and a polymer dissolved into the high dielectric solvent. A method of forming particles including dissolving a polymer in a high dielectric solvent to form a high dielectric composition, and dielectrophoretically spinning the high dielectric composition in an electric field to form particles.

Claims (16)

1 - 22 . (canceled)

23 . A method of forming particles comprising:

a) dissolving a polymer in a high dielectric solvent to form a high dielectric composition; and

b) dielectrophoretically spinning the high dielectric composition in an electric field to form particles.

24 . The method of claim 23 , wherein further comprising adding a high dielectric additive to the high dielectric composition before the dielectrophoretic spinning.

25 . The method of claim 23 , further comprising attenuating the high dielectric composition before the dielectrophoretic spinning to form pre-particles.

26 . The method of claim 25 , wherein the mechanical attenuation is performed using at least one of:

a) at least one rotating disk;

b) melt blowing; and,

c) one or more dispensing needles.

27 . The method of claim 26 , further comprising heating at least one of the composition, the mechanical attenuation apparatus, and the surrounding ambient environment.

28 . The method of claim 23 , wherein the high dielectric composition includes at least one of a dispersant and surfactant selected to provide enhanced dispersion of a high dielectric additive and solvent therein.

29 . The method of claim 23 , wherein the solvent and polymers have very different solubility parameters, and further comprising at least one of a dispersant and surfactant selected to encourage the solvent and polymer to disperse.

30 . The method of claim 29 , wherein the polymer has a low dielectric constant and the solvent has a high dielectric constant.

31 . The method of claim 23 , wherein high dielectric composition is formed by dissolving the polymer into the solvent under the application of heat.

32 - 64 . (canceled)