Semiconductor device including air gaps between interconnects and method of manufacturing the same
A semiconductor device includes a substrate, and interconnects provided above the substrate. The device further includes a first insulator that is provided on the interconnects and on air gaps provided between the interconnects, surrounds the interconnects from lateral sides of the interconnects, and is formed of a first insulating material. The device further includes a second insulator that surrounds an interconnect region including the interconnects and the air gaps from the lateral sides of the interconnects through the first insulator, includes no portion provided between the interconnects, and is formed of a second insulating material different from the first insulating material.
1. A semiconductor device comprising:
a substrate;
interconnects provided above the substrate;
a first insulator that is provided on the interconnects and on air gaps provided between the interconnects, surrounds the interconnects from lateral sides of the interconnects, and is formed of a first insulating material; and
a second insulator that surrounds an interconnect region including the interconnects and the air gaps from the lateral sides of the interconnects through the first insulator, includes no portion provided between the interconnects, and is formed of a second insulating material different from the first insulating material.
2. The device of claim 1 , wherein a Young's modulus of the second insulator is higher than a Young's modulus of the first insulator.
3. The device of claim 1 , wherein the second insulator comprises at least one of a silicon nitride, a silicon carbide, an aluminum oxide, and an aluminum nitride.
4. The device of claim 1 , wherein
a height of an upper end of the second insulator is higher than heights of upper ends of the interconnects and heights of upper ends of the air gaps, and
a height of an lower end of the second insulator is lower than heights of lower ends of the interconnects and heights of lower ends of the air gaps.
5. The device of claim 1 , wherein a minimum distance between a side face of an outermost interconnect in the interconnect region and a side face of the second insulator is 100 μm or less.
6. The device of claim 1 , wherein the second insulator comprises a first portion having an annular shape that surrounds the interconnect region from the lateral sides of the interconnects.
7. The device of claim 6 , wherein the first portion has a quadrangular annular shape.
8. The device of claim 6 , wherein the second insulator further comprises a second portion provided above the interconnect region through the first insulator.
9. The device of claim 6 , wherein a region on the substrate comprises:
a first region that overlaps with an inner region of the first portion in a direction that is perpendicular to a surface of the substrate; and
a second region that overlaps with an outer region of the first portion in the direction that is perpendicular to the surface of the substrate,
wherein the device further comprises an element or an interconnect provided in the second region.