SEMICONDUCTOR CELL

1 . A semiconductor cell comprising:

a substrate;

a buffer structure disposed on the substrate;

a channel layer having a band gap, and comprising a first portion and a first protrusion wherein the first portion is disposed on the buffer structure, and the first protrusion is disposed on the first portion and has a first top surface and a first inclined surface connecting to the first top surface;

a barrier having a band gap greater than the band gap of the channel layer, disposed on the channel layer, and comprising a second portion and a second protrusion wherein the second portion is disposed on the first portion, the second protrusion covers the first top surface of the first protrusion and has a second top surface and a second inclined surface connecting to the second top surface, and the second inclined surface is parallel to the first inclined surface;

a first electrode disposed on the second protrusion; and

a second electrode disposed on the second portion of the barrier and separated from the first electrode.

2 . The semiconductor cell as claimed in claim 1 , wherein a two dimensional electron gas is formed in the channel layer and near the top surface and/or an interface between the first portion and the second portion.

3 . The semiconductor cell as claimed in claim 1 , wherein a material of the channel layer comprises GaN, and a material of the barrier comprises Al x Ga 1-x N wherein 0.2<×<0.3.

4 . The semiconductor cell as claimed in claim 3 , wherein a shortest distance between the first inclined surface and the second inclined surface is smaller than or equal to a shortest distance between the first top surface and the second top surface.

5 . The semiconductor cell as claimed in claim 1 , wherein the first inclined surface is a crystalline plane, and a crystalline direction of the first inclined surface comprises {1 1 01} or {11 2 2}, or an included angle between the first inclined surface and a surface of the first portion is 61.9 degrees or 58.9 degrees.

6 . The semiconductor cell as claimed in claim 5 , wherein the first protrusion further comprises a third inclined surface, the second protrusion further comprises a fourth inclined surface, the third inclined surface is parallel to the fourth inclined surface, and a shortest distance between the third inclined surface and the fourth inclined surface is smaller than or equal to a shortest distance between the first top surface and the second top surface.

7 . The semiconductor cell as claimed in claim 6 , wherein the third inclined surface is a crystalline plane, and a crystalline direction of the third inclined surface is the same as the crystalline direction of the first inclined surface.

8 . The semiconductor cell as claimed in claim 1 , further comprising a third electrode, wherein the first electrode is a gate electrode, the second electrode is a source electrode, the third electrode is a drain electrode, and the first electrode is disposed between the second electrode and the third electrode.

9 . The semiconductor cell as claimed in claim 8 , further comprising a p type semiconductor layer disposed between the third electrode and the second protrusion wherein the p type semiconductor layer has a band gap, and a band gap of the p type semiconductor layer is smaller than the band gap of the barrier.

10 . The semiconductor cell as claimed in claim 1 , wherein the first electrode is an anode and the second electrode is a cathode.