Apparatus and method for treating surface of strip casting twin roll
An apparatus for treating a surface of a strip casting twin roll includes: a laser machining unit configured to form dimple patterns on a surface of a rotating casting roll using a laser; a machining region processing unit, wherein if the casting roll is rotated by a critical angle, the machining region processing unit calculates a size and a position of a machining region, in which a dimple pattern will be formed, based on image information obtained by imaging the machining region; and a laser beam absorbing unit, wherein if the size of the machining region is smaller than a size of the dimple pattern, the laser beam absorbing unit places a screen at an overlap start position from which the machining region and the dimple pattern start to overlap each other, so as to absorb a laser beam emitted toward a peripheral region of the machining region.
1. An apparatus for treating a surface of a strip casting twin roll, the apparatus comprising:
a laser machining unit configured to form dimple patterns on a surface of a rotating casting roll using a laser;
a machining region processing unit, wherein if the casting roll is rotated by a critical angle, the machining region processing unit calculates a size and a position of a machining region, in which a dimple pattern will be formed, based on image information obtained by imaging the machining region; and
a laser beam absorbing unit, wherein if the size of the machining region is smaller than a size of the dimple pattern, the laser beam absorbing unit places a screen at an overlap start position from which the machining region and the dimple pattern start to overlap each other, so as to absorb a laser beam emitted toward a peripheral region of the machining region.
2. The apparatus of claim 1 , wherein a masking film is formed on the surface of the casting roll.
3. The apparatus of claim 1 , wherein the laser machining unit comprises:
a laser head unit configured to emit a laser beam toward the machining region;
a transfer unit configured to move the laser head unit to a work position;
a casting roll rotating unit configured to rotate the casting roll at a preset velocity; and
a central control unit configured to determine a laser beam output position and a laser beam output time by receiving information regarding rotation of the casting roll and a position of the laser head unit in real time.
4. The apparatus of claim 3 , wherein the laser machining unit further comprises a dust collecting unit configured to collect masking film dust separated from the surface of the casting roll after a laser beam is emitted to the surface of the casting roll.
5. The apparatus of claim 1 , wherein the machining region processing unit comprises:
a first comparison unit configured to compare a rotation angle of the casting roll with a critical angle;
a first processing unit, wherein if the rotation angle of the casting roll is greater than the critical angle, the first processing unit calculates the size and position of the machining region based on a captured image of the machining region;
a second comparison unit configured to compare the size of the machining region with the size of the dimple pattern; and
a second processing unit, wherein if the size of the machining region is smaller than the size of the dimple pattern, the second processing unit provides positional information regarding the overlap start position from which the machining region and the dimple pattern start to overlap each other to the laser beam absorbing unit.
6. The apparatus of claim 5 , wherein the laser beam absorbing unit comprises:
a laser beam blocking film; and
a moving unit configured to move the laser beam blocking film to the overlap start position based on the positional information.
7. A method for treating a surface of a strip casting twin roll, the method comprising:
after rotating a casting roll by a predetermined angle, forming a dimple pattern having a predetermined size on a surface of the casting roll using a line laser;
if the casting roll is rotated by a critical angle, after imaging a machining region in which the dimple pattern will be formed, calculating the machining region based on a captured image; and
after comparing a size of the machining region with the size of the dimple pattern, if the size of the machining region is smaller than the size of the dimple pattern, moving a screen of a laser beam absorbing unit to an overlap start position from which the machining region and the dimple pattern start to overlap each other, based on positional information regarding the overlap start position.
8. The method of claim 7 , wherein the calculating of the machining region comprises:
comparing a rotation angle of the casting roll with the critical angle;
providing image information regarding the machining region; and
if the rotation angle of the casting roll is greater than the critical angle, calculating the size and a position of the machining region based on the image information.
9. The method of claim 7 , wherein the moving of the screen comprises:
comparing the size of the machining region with the size of the dimple pattern;
calculating the overlap start position from which the machining region and the dimple pattern start to overlap each other, if the size of the machining region is smaller than the size of the dimple pattern;
providing positional information regarding the overlap start position to the laser beam absorbing unit; and
moving the screen of the laser beam absorbing unit to the overlap start position.