Electronic device having a member for chassis
An electronic device having a member for chassis is disclosed. The member for chassis includes a surface layer, a rear layer disposed inside of the surface layer in a thickness direction, and an intermediate layer disposed between the surface layer and the rear layer. Each of the surface layer and the rear layer includes a fiber-reinforced resin plate. The intermediate layer is made of a material that is compressible in the thickness direction. The member for chassis further includes a fastening hole that penetrates through the surface layer, the intermediate layer and the rear layer, through which a fastener passes to fix the member for chassis to a member for attachment. The surface layer includes a cut line having a larger diameter than the fastening hole in order to surround the fastening hole.
1. A chassis cover comprising:
a first layer;
a second layer;
an intermediate layer disposed between said first layer and said second layer, wherein said first layer and said second layer each including a fiber-reinforced resin plate, and said intermediate layer is made of a compressible material;
a fastening hole that penetrated through said first layer, said intermediate layer and said second layer, wherein said fastening hole is configured to receive a fastener; and
a cylindrical cut line disposed in said first layer in a thickness direction orthogonal to a surface of said first layer, wherein said cylindrical cut line has a larger diameter than said fastening hole in order to surround said fastening hole wherein said cylindrical cut line allows said fastener to depress a ring-shaped piece of said first layer into said intermediate layer such that a surface of said fastener is flush with said surface of said first layer.
2. The chassis cover of claim 1 , wherein said cylindrical cut line cuts across the entire thickness of said first layer.
3. The chassis cover of claim 1 , wherein said ring-shaped piece remains to be located in said first layer until after being pushed by said fastener into said intermediate layer.
4. The chassis cover of claim 1 , wherein said cylindrical cut line is formed by laser processing.
5. An electronic device comprising:
a display chassis having a display device; and
a body chassis having a keyboard device, wherein said body chassis includes:
a first layer;
a second layer;
an intermediate layer disposed between said first layer and said second layer, wherein said first layer and said second layer each including a fiber-reinforced resin plate, and said intermediate layer is made of a compressible material;
a fastening hole that penetrated through said first layer, said intermediate layer and said second layer, wherein said fastening hole is configured to receive a fastener; and
a cylindrical cut line disposed in said first layer in a thickness direction orthogonal to a surface of said first layer, wherein said cylindrical cut line has a larger diameter than said fastening hole in order to surround said fastening hole wherein said cylindrical cut line allows said fastener to depress a ring-shaped piece of said first layer into said intermediate layer such that a surface of said fastener is flush with said surface of said first layer.
6. The electronic device of claim 5 , wherein said, cylindrical cut line cuts across the entire thickness of said first layer.
7. The electronic device of claim 5 , wherein said cylindrical cut line allows said fastener to depress a ring-shaped piece of said first layer into said intermediate layer such that a surface of said fastener is flush with said surface of said first layer.
8. The electronic device of claim 7 , wherein said ring-shaped piece remains to be located in said first layer until after being pushed by said fastener into said intermediate layer.
9. The electronic device of claim 5 , wherein said cylindrical cut line is formed by laser processing.
10. A method comprising:
forming a chassis cover by placing an intermediate layer made of a compressible material between a first layer having a fiber-reinforced resin plate and a second layer having a fiber-reinforced resin plate;
forming a fastening hole that penetrates through said first layer, said intermediate layer and said second layer of said chassis cover; and
providing a cylindrical cut line surrounding said fastening hole in said first layer in a thickness direction orthogonal to a surface of said first layer, wherein said cylindrical cut line has a larger diameter than said fastening hole in order to surround said fastening hole, wherein said method further includes placing a fastener into said fastening hole to depress a ring-shaped piece of said first layer along said cylindrical cut line into said intermediate layer such that a surface of said fastener is flush with said surface of said first layer, and wherein said ring-shaped piece remains to be located in said first layer until after being pushed by said fastener into said intermediate layer.
11. The method of claim 10 , wherein said providing further includes providing said cylindrical cut line via laser processing.
12. The method of claim 10 , wherein said cylindrical cut line cuts across the entire thickness of said first layer.