IP Library Granted Patent US 9,970,980
Granted Patent B2
US 9,970,980 · App. 15/248,760 · Granted May 15, 2018

Test circuit for stress leakage measurements

Inventor: Emanuele Bodano (Villach, AT)
Assignee: Infineon Technologies AG
G01R31/2621G01R31/27
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Quick Facts
Patent No.
US 9,970,980
App. No.
15/248,760
Granted
May 15, 2018
Kind
B2
Abstract

In accordance with an embodiment, a circuit includes: a gate drive circuit; an output transistor, and a gate coupled to the gate drive circuit; a normally-on transistor including a load path coupled to the gate drive circuit and to the gate of the output transistor; and a pull-up device, where the output transistor is configured to provide a test leakage current in a test mode when a measurement voltage is applied to a current test node coupled to the gate of the output transistor and a turn-off voltage is applied to the gate of the normally-on transistor; and the gate drive circuit is configured to provide a gate drive voltage to the gate of the output transistor in a nominal operation mode when a voltage of the gate of the normally-on transistor is pulled-up to a voltage of the pull-up node via the pull-up device.

Claims (79)

1. A circuit comprising:

a gate drive circuit;

an output transistor having a first load path coupled between a supply node and an output node, and a gate coupled to the gate drive circuit;

a normally-on transistor comprising a second load path coupled to the gate drive circuit and to the gate of the output transistor; and

a pull-up device coupled between a gate of the normally-on transistor and a pull-up node, wherein

the output transistor is configured to provide a test leakage current in a test mode when a measurement voltage is applied to a current test node coupled to the gate of the output transistor and a turn-off voltage is applied to the gate of the normally-on transistor; and

the gate drive circuit is configured to provide a gate drive voltage to the gate of the output transistor in a nominal operation mode when a voltage of the gate of the normally-on transistor is pulled-up to a voltage of the pull-up node via the pull-up device.

2. The circuit of claim 1 , wherein

the pull-up device comprises a resistor, and

the normally-on transistor comprises a depletion MOS transistor.

3. The circuit of claim 2 , wherein the depletion MOS transistor is an NMOS transistor.

4. The circuit of claim 1 , further comprising:

a first voltage generator coupled to the a gate of the normally-on transistor, the first voltage generator configured to provide the turn-off voltage; and

a second circuit coupled to the current test node, the second circuit comprising

a second voltage generator configured to provide the measurement voltage, and

a current measurement circuit configured to measure the test leakage current.

5. The circuit of claim 4 , wherein the first voltage generator provides the turn-off voltage while the second voltage generator provides the measurement voltage and the current measurement circuit measures the test leakage current.

6. The circuit of claim 5 , wherein the circuit is categorized as having a defect when the test leakage current is bigger than a reference current.

7. The circuit of claim 4 , wherein the first voltage generator and the second circuit are circuits of an automatic test equipment (ATE).

8. The circuit of claim 4 , wherein the first voltage generator and the second circuit are circuits of the same integrated circuit.

9. The circuit of claim 4 , wherein

the test leakage current is negative,

the turn-off voltage is negative, and

the measurement voltage is zero.

10. The circuit of claim 1 , wherein

the output transistor comprises an NMOS transistor having a second source coupled to ground and a second drain; and

the gate drive circuit comprises

a third transistor coupled to an output of the gate drive circuit, and

a fourth transistor coupled to the output of the gate drive circuit.

11. The circuit of claim 1 , wherein

the output transistor is a PMOS transistor; and

the gate drive circuit comprises

a third transistor coupled to an output of the gate drive circuit, and

a fourth transistor coupled to the output of the gate drive circuit.

12. The circuit of claim 11 , wherein

the second load path is coupled between the gate drive circuit and the supply node of the output transistor; and

the pull-up node comprises the supply node.

13. The circuit of claim 11 , further comprising a bias circuit coupled to the gate of the normally-on transistor, wherein the second load path is coupled between the gate drive circuit and the gate of the output transistor.

14. The circuit of claim 1 , wherein

the output transistor is a PMOS transistor; and

the gate drive circuit comprises a third transistor coupled to an output of the gate drive circuit, the third transistor configured to mirror a polarization current into the first load path.

15. The circuit of claim 14 , wherein

the second load path is coupled between the gate drive circuit and a source of the output transistor; and

the pull-up node comprises the source of the output transistor.

16. The circuit of claim 14 , wherein the second load path is coupled between the gate drive circuit and the gate of the output transistor; and

the pull-up node comprises the supply node.

17. The circuit of claim 1 , wherein the gate drive circuit is configured to provide a gate drive voltage to the gate of the output transistor in a power-down state when a voltage of the gate of the normally-on transistor is pulled-up to the pull-up node via the pull-up device.

18. The circuit of claim 1 , wherein the pull-up device comprises a transistor.

19. A method of operating a device comprising a first transistor, the method comprising:

performing a leakage stress testing operation comprising

preventing a current from flowing between a gate of the first transistor and a third circuit by turning off a normally-on transistor coupled to the gate of the first transistor and to the third circuit,

applying a first stress voltage to the gate of the first transistor, and

measuring a first current flowing from the gate of the first transistor; and

performing, by the device, a normal operation comprising turning on the normally-on transistor.

20. The method of claim 19 , further comprising performing a power down operation comprising turning on the normally-on transistor.

21. The method of claim 19 , wherein the leakage stress testing operation further comprises applying a second stress voltage to a source of the first transistor.

22. The method of claim 21 , wherein the source of the first transistor is coupled to a drain of the first transistor.

23. The method of claim 21 , wherein

the third circuit controls the gate of the first transistor;

applying the first stress voltage comprises applying 8 V; and

applying the second stress voltage comprises applying 2 V.

24. The method of claim 19 , wherein the turning on the normally-on transistor comprises pulling up a gate of the normally-on transistor to a pull-up node.

25. The method of claim 24 , wherein the pull-up node is coupled to a source of the normally-on transistor.

26. The method of claim 19 , wherein the turning on the normally-on transistor comprises pulling up a gate of the normally-on transistor by a bias circuit.

27. The method of claim 19 , wherein the turning on the normally-on transistor comprises pulling up a gate of the normally-on transistor to a source of the first transistor.

28. The method of claim 19 , further comprising categorizing the device as good if the first current is lower than a predetermined current, and categorizing the device as bad if the first current is higher than the predetermined current.

29. A circuit comprising:

an integrated circuit comprising

a first circuit,

an output transistor having a first load path coupled between a supply node and an output node, and a gate coupled to the first circuit,

a first test node coupled to the gate of the output transistor,

a depletion NMOS transistor comprising a second load path coupled between the first circuit and the gate of the output transistor,

a second test node coupled to a gate of the depletion NMOS transistor, and

a pull-up element coupled between the gate of the depletion NMOS transistor and a pull-up node.

30. The circuit of claim 29 , further comprising

a first voltage generator coupled to the second test node and configured to provide a first stress voltage;

a second voltage generator coupled to the first test node and configured to provide a measurement voltage; and

a current measurement circuit coupled to the second voltage generator and configured to measure leakage current.

31. The circuit of claim 29 , wherein the pull-up element comprises a transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2016
From: BODANO, EMANUELE
To: INFINEON TECHNOLOGIES AG
Reel/Frame 039556/0900 →
Continuity (1)
Related Publication 20180059166A1 · Mar 1, 2018