IP Library Granted Patent US 10,374,300
Granted Patent B2
US 10,374,300 · App. 15/250,719 · Granted Aug 6, 2019

Apparatus with partitioned radio frequency antenna structure and associated methods

Inventors: Pasi Rahikkala (Vihti, FI); Attila Zolomy (Budapest, HU)
Assignee: Silicon Laboratories Inc.
H01Q1/38H01Q1/24H01Q1/241H01Q9/0485
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Quick Facts
Patent No.
US 10,374,300
App. No.
15/250,719
Granted
Aug 6, 2019
Kind
B2
Abstract

An apparatus includes a radio frequency (RF) circuit to transmit or receive RF signals, and a partitioned antenna structure. The partitioned antenna structure includes a first portion of a resonator and a first portion of a radiator. The first portion of the resonator comprises less than an entire resonator. The first portion of the radiator comprises less than an entire radiator.

Claims (39)

1. An apparatus, comprising:

a radio frequency (RF) circuit to transmit or receive RF signals; and

a partitioned antenna structure comprising:

a first portion of a resonator and a first portion of a radiator; and

a chip antenna,

wherein the first portion of the resonator comprises less than an entire resonator and the first portion of the radiator comprises less than an entire radiator.

2. The apparatus according to claim 1 , wherein the partitioned antenna structure is included in an RF module.

3. The apparatus according to claim 2 , wherein the RF module is affixed to a substrate.

4. The apparatus according to claim 3 , wherein the substrate includes a second portion of the resonator and a second portion of the radiator.

5. The apparatus according to claim 4 , wherein the entire resonator comprises the first and second portions of the resonator.

6. The apparatus according to claim 4 , wherein the entire radiator comprises the first and second portions of the radiator.

7. The apparatus according to claim 4 , wherein the module further comprises a first substrate used to fabricate the first portion of the resonator and the first portion of the radiator.

8. The apparatus according to claim 7 , further comprising a second substrate, wherein the module is coupled to the second substrate, and wherein the second substrate is used to fabricate the second portion of the resonator and the second portion of the radiator.

9. The apparatus according to claim 1 , wherein the partitioned antenna structure is included in an RF module, and wherein the RF circuit is included in the module and is electrically coupled to the partitioned antenna structure.

10. A method of making a radio frequency (RF) apparatus with a partitioned antenna structure, the method comprising:

partitioning the antenna structure into first and second portions; and

including in a module a chip antenna, and the first portion of the antenna structure,

wherein the first portion of the antenna structure is less than the entire antenna structure, and

wherein the second portion of the antenna structure is external to the module.

11. The method according to claim 10 , wherein the antenna structure comprises a resonator and a radiator, and wherein partitioning the antenna structure into first and second portions further comprises partitioning either the resonator or the radiator into first and second portions.

12. The method according to claim 10 , wherein the antenna structure comprises a resonator and a radiator, and wherein partitioning the antenna structure into first and second portions further comprises partitioning both the resonator and the radiator into first and second portions.

13. The method according to claim 10 , wherein the antenna structure comprises a combined resonator and radiator, and wherein partitioning the antenna structure into first and second portions further comprises partitioning the combined resonator and radiator into first and second portions.

14. The method according to claim 10 , further comprising:

affixing the module to a substrate; and

using the substrate to fabricate the second portion of the antenna structure.

15. An radio frequency (RF) communication apparatus comprising:

a module comprising:

an RF circuit to transmit or receive RF signals;

a chip antenna coupled to the RF circuit;

a first portion of a resonator; and

a first portion of a radiator; and

a first substrate coupled to the module, the first substrate comprising:

a second portion of the resonator; and

a second portion of the radiator.

16. The apparatus according to claim 15 , wherein the module includes a second substrate, and wherein the RF circuit, the chip antenna, the first portion of the resonator, and the first portion of the radiator are coupled to the second substrate.

17. The apparatus according to claim 15 , wherein the first and second portions of the resonator form an entire resonator, and wherein the first and second portions of the radiator form an entire radiator.

18. The apparatus according to claim 15 , further comprising a baseband circuit coupled to the RF circuit.

19. The apparatus according to claim 15 , wherein the first portion of the resonator comprises the chip antenna and/or a layout of the second substrate.

20. The apparatus according to claim 15 , wherein the first portion of the radiator comprises the chip antenna and/or a layout of the second substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2016
From: RAHIKKALA, PASI; ZOLOMY, ATTILA
To: SILICON LABORATORIES INC.
Reel/Frame 039569/0713 →
Continuity (1)
Related Publication 20180062254A1 · Mar 1, 2018