Moldable earpiece system
An earpiece including an external surface having a first fixed configuration disposable within the outer ear and having a passage adapted for retention of an in ear device, the earpiece heatable to achieve a moldable condition which allows reconfiguration of the external surface by engagement with the outer ear to dispose the external surface in a second fixed configuration in greater conformity to the outer ear.
1. A moldable earpiece for an in-ear device, comprising:
an earpiece having an external surface having a fixed configuration disposable within an auricle of an ear; and
a conduit disposed within said earpiece, said conduit having an internal surface which defines a passage which communicates between a first location and a second location on said external surface of said earpiece, said internal surface of said conduit having a configuration which releasably retains said in-ear device in said passage, said earpiece heatable to achieve a moldable condition which allows reconfiguration of said external surface by engagement with said auricle, said conduit maintaining said configuration which releasably retains said in-ear device in said passage during reconfiguration of said external surface.
2. The moldable earpiece of claim 1 , wherein said conduit disposed in said earpiece to align said passage with an ear canal of said ear.
3. The moldable earpiece of claim 2 , wherein said conduit comprises a flexible elastomer layer.
4. The moldable earpiece of claim 2 , wherein said conduit comprises a flexible elastomer insert which removably couples within said earpiece.
5. The moldable earpiece of claim 1 , wherein said earpiece comprises an amount of composition which maintains said fixed configuration at a temperature below about 40° C. (110° F.) and maintains said moldable condition at a temperature of between about 40° C. (about 110° F.) and about 65° C. (150° F.).
6. The moldable earpiece of claim 5 , wherein said amount of composition comprises an amount of polycaprolactone polymer having a number average molecular weight of between about 37,000 grams per mole and about 80,000 grams per mole.
7. The moldable earpiece of claim 6 , wherein said earpiece achieves said moldable condition by heating said earpiece for a period of time within a heated enclosure maintained at about 70° C. (160° F.).
8. The moldable earpiece of claim 6 , wherein said earpiece achieves said moldable condition by exposure of said earpiece for a period of time to an amount of microwave radiation.
9. The moldable earpiece of claim 6 , wherein said earpiece achieves said moldable condition by disposal in an amount of liquid having temperature of between about 40° C. (about 110° F.) and about 65° C. (150° F.).
10. The moldable earpiece of claim 6 , wherein said earpiece achieves said moldable condition by disposal in an amount of liquid, said earpiece disposed in said amount of liquid exposed to an amount of microwave radiation.
11. The moldable earpiece of claim 10 , wherein said amount of liquid comprises an amount of water.
12. The moldable earpiece of claim 1 , wherein said in-ear device is selected from the group consisting of: earphones, earplugs, earbuds, ear tips, ear tubes, ear sealing ballons, and in-ear hearing aids.
13. The moldable earpiece of claim 12 , wherein said in-ear device is a part of an apparatus which resides outside of said ear.
14. The moldable earpiece of claim 13 , wherein said apparatus is selected from the group consisting of: headsets, head phones, telephones, blue tooth headphones, wireless headphones, and hearing aids.