Control device and control method of semiconductor manufacturing apparatus

1. A control device of a semiconductor manufacturing apparatus, the control device comprising a processor and a memory connected to the processor, the memory storing instructions executable by the processor to:

collect a sound of processing a substrate by the semiconductor manufacturing apparatus;

calculate a difference between a power spectrum of the processing sound at a first point of time and a power spectrum of the processing sound at a second point of time; and

determine a change point of processing of the substrate based on the difference,

wherein the instructions to calculate the difference include instructions executable by the processor to calculate a first value based on the difference in a first frequency bandwidth, and calculate a second value based on the difference in a second frequency bandwidth,

wherein the instructions to determine the change point include instructions executable by the processor to determine the change point based on the first value and the second value,

wherein the instructions to calculate the difference include instructions executable by the processor to calculate a signal to noise ratio (S/N ratio) of the processing sound based on the first and second values, and

wherein the instructions to determine the change point include instructions executable by the processor to determine the change point based on the S/N ratio.

2. The device according to claim 1 ,

wherein the first value is an average value of the difference in the first frequency bandwidth, and

wherein the second value is an average value of the difference in the second frequency bandwidth.

3. The device according to claim 1 , wherein the instructions to calculate the difference include instructions executable by the processor to change the first and second frequency bandwidths based on information on the substrate.

4. The device according to claim 1 ,

wherein the instructions to collect the processing sound include instructions executable by the processor to collect, from a sound sensor, the processing sound and a reference sound for calibration of the sound sensor, and

the memory further storing instructions executable by the processor to:

acquire a measurement value of a frequency of the reference sound using the collected reference sound,

read a setting value of the frequency of the reference sound from a record unit, and

calibrate the sound sensor based on the measurement value of the frequency of the reference sound and the setting value of the frequency of the reference sound.

5. The device according to claim 1 ,

wherein the instructions to determine the change point include instructions executable by the processor to determine the change point based on the difference in a predetermined frequency bandwidth, and

the memory further storing instructions executable by the processor to:

determine a setting of the predetermined frequency bandwidth based on the processing sound which is collected when a first substrate is processed, and

change the predetermined frequency bandwidth according to the setting when a second substrate is processed.

6. The device according to claim 5 , wherein the memory further storing instructions executable by the processor to:

generate first image data indicating a relationship between power spectrums of the processing sound, which is collected when the first substrate is processed, and time, and

determine the setting of the predetermined frequency bandwidth by collating the first image data with second image data which represents a relationship between a power spectrum of the change point and time.

7. The device according to claim 1 , wherein the memory further storing instructions executable by the processor to:

control the semiconductor manufacturing apparatus such that processing of the substrate ends, responsive to detecting the change point.

8. A control method of a semiconductor manufacturing apparatus, the method comprising:

collecting a sound of processing a substrate by the semiconductor manufacturing apparatus;

calculating a difference between a power spectrum of the processing sound at a first point of time and a power spectrum of the processing sound at a second point of time;

determining a change point of processing of the substrate based on the difference;

controlling processing of the substrate by the semiconductor manufacturing apparatus based on the change point;

calculating a first value based on the difference in a first frequency bandwidth;

calculating a second value based on the difference in a second frequency bandwidth;

determining the change point based on the first value and the second value;

calculating a signal to noise ratio (S/N ratio) of the processing sound based on the first and second values; and

determining the change point based on the S/N ratio.

9. The control method according to claim 8 ,

wherein the first value is an average value of the difference in the first frequency bandwidth, and

wherein the second value is an average value of the difference in the second frequency bandwidth.

10. The control method according to claim 8 , further comprising:

changing the first and second frequency bandwidths based on information on the substrate.

11. The control method according to claim 8 , further comprising:

collecting, from a sound sensor, the processing sound and a reference sound for calibration of the sound sensor, and

acquiring a measurement value of a frequency of the reference sound using the collected reference sound,

reading a setting value of the frequency of the reference sound from a record unit, and

calibrating the sound sensor based on the measurement value of the frequency of the reference sound and the setting value of the frequency of the reference sound.

12. The control method according to claim 8 , further comprising:

determining the change point based on the difference in a predetermined frequency bandwidth, and

determining a setting of the predetermined frequency bandwidth based on the processing sound which is collected when a first substrate is processed, and

changing the predetermined frequency bandwidth according to the setting when a second substrate is processed.

13. The control method according to claim 12 , further comprising:

generating first image data indicating a relationship between power spectrums of the processing sound, which is collected when the first substrate is processed, and time, and

determining the setting of the predetermined frequency bandwidth by collating the first image data with second image data which represents a relationship between a power spectrum of the change point and time.

14. The control method according to claim 8 , further comprising:

controlling the semiconductor manufacturing apparatus such that processing of the substrate ends, responsive to detecting the change point.

15. A control device of a semiconductor manufacturing apparatus, the control device comprising:

a characteristic extraction circuit to calculate a difference between a power spectrum of a sound of processing a substrate by the semiconductor manufacturing apparatus at a first point of time and a power spectrum of the processing sound at a second point of time; and

an end point determining circuit to determine a change point of processing of the substrate based on the difference,

wherein the characteristic extraction circuit is configured to calculate a first value based on the difference in a first frequency bandwidth, and calculate a second value based on the difference in a second frequency bandwidth,

wherein the end point determining circuit is configured to determine the change point based on the first value and the second value,

wherein characteristic extraction circuit is configured to calculate a signal to noise ratio (S/N ratio) of the processing sound based on the first and second values, and

wherein the end point determining circuit is configured to determine the change point based on the S/N ratio.

16. The device according to claim 15 , further comprising:

an output circuit to control the semiconductor manufacturing apparatus such that processing of the substrate ends, responsive to determining the change point.