IP Library Granted Patent US 9,644,671
Granted Patent B2
US 9,644,671 · App. 15/255,646 · Granted May 9, 2017

Bearing assemblies including a thermally conductive structure, bearing apparatuses, and methods of use

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Quick Facts
Patent No.
US 9,644,671
App. No.
15/255,646
Granted
May 9, 2017
Kind
B2
Abstract

Embodiments of the invention are directed to bearing assemblies configured to effectively provide heat distribution from and/or heat dissipation for bearing element, bearing apparatuses including such bearing assemblies, and methods of operating such bearing assemblies and apparatuses. In an embodiment, a bearing assembly includes a plurality of superhard bearing elements distributed about an axis. Each superhard bearing element of the plurality of superhard bearing elements has a superhard material including a superhard surface. Additionally, a support ring structure that includes a support ring that supports the plurality of superhard bearing elements and a thermally-conductive structure in thermal communication with the superhard table of each of the plurality of superhard bearing elements. The thermally-conductive structure has a higher thermal conductivity than the support ring of the support ring structure.

Claims (37)

1. A bearing assembly, comprising:

a plurality of superhard bearing elements distributed about an axis, each of the plurality of superhard bearing elements having a substrate and a superhard table bonded thereto, the superhard table forming a superhard bearing surface; and

a support ring structure including:

a support ring that supports the plurality of superhard bearing elements; and

at least one thermally-conductive structure in thermal communication with the support ring and in thermal communication with at least one of the substrates of the plurality of superhard bearing elements, the at least one thermally-conductive structure having a higher thermal conductivity than the support ring.

2. The bearing assembly of claim 1 , wherein each of the superhard tables includes polycrystalline diamond.

3. The bearing assembly of claim 2 , wherein each of the substrates includes cemented tungsten carbide.

4. The bearing assembly of claim 1 , wherein the at least one thermally-conductive structure includes at least one thermally-conductive element secured to the support ring.

5. The bearing assembly of claim 4 , wherein each of the substrates includes a post in thermal communication with the at least one thermally-conductive element.

6. The bearing assembly of claim 5 , wherein the post is in thermal communication with the superhard table of each of the plurality of superhard bearing elements.

7. The bearing assembly of claim 4 , wherein each of the substrates of the plurality of superhard bearing elements is brazed to at least one of the support ring or to the at least one thermally-conductive structure.

8. The bearing assembly of claim 4 , wherein the at least one thermally-conductive element is located within an interior channel of the support ring.

9. The bearing assembly of claim 4 , wherein the at least one thermally-conductive element at least partially encloses the support ring.

10. The bearing assembly of claim 4 , wherein the at least one thermally-conductive element at least partially forms a support surface of the support ring structure.

11. The bearing assembly of claim 1 , wherein each of the plurality of the superhard bearing surfaces of the plurality of superhard bearing elements is substantially planar.

12. The bearing assembly of claim 1 , wherein each of the plurality of the superhard bearing surfaces of the plurality of superhard bearing elements is convex or concave.

13. The bearing assembly of claim 1 , wherein the support ring includes one or more of alloy steel, carbon steel, stainless steel, or tungsten carbide, and wherein the at least one thermally-conductive structure includes one or more of copper, copper alloys, aluminum, aluminum alloys, brass, bronze, gold, silver, graphite, or diamond.

14. The bearing assembly of claim 1 , wherein at least a portion of the at least one thermally-conductive structure defines at least a portion of a support surface of the support ring structure.

15. A bearing apparatus, comprising:

a first bearing assembly including:

one or more first bearing surfaces; and

a first support ring carrying the one or more first bearing surfaces; and

a second bearing assembly including:

a plurality of superhard bearing elements distributed about an axis, each of the plurality of superhard bearing elements having a superhard table including a second bearing surface, the superhard table bonded to a substrate; and

a support ring structure including:

a second support ring that supports the plurality of superhard bearing elements; and

at least one thermally-conductive structure in thermal communication with the support ring and in thermal communication with at least one of the substrates of the plurality of superhard bearing elements, the at least one thermally-conductive structure having a higher thermal conductivity than the second support ring;

wherein the at least one thermally-conductive structure includes one or more of copper, copper alloys, aluminum, aluminum alloys, brass, bronze, gold, silver, graphite, or diamond.

16. The bearing apparatus of claim 15 , wherein the first bearing assembly includes one or more superhard bearing elements that include the one or more first bearing surfaces.

17. The bearing apparatus of claim 16 , wherein the first bearing assembly includes another thermally-conductive structure in thermal communication with the first support ring and in thermal communication with the one or more superhard bearing elements of the first bearing assembly.

18. The bearing apparatus of claim 15 , wherein each of the one or more first bearing surfaces and the second superhard bearing surfaces is substantially planar.

19. The bearing apparatus of claim 15 , wherein the at least one thermally-conductive structure includes a ring-shaped thermally conductive element in thermal communication with the plurality of superhard bearing elements.

20. A bearing assembly, comprising:

a plurality of superhard bearing elements distributed about an axis, each of the plurality of superhard bearing elements having a cemented carbide substrate and a polycrystalline diamond table bonded thereto, the polycrystalline diamond table forming a superhard bearing surface; and

a support ring structure including:

a support ring that supports the plurality of superhard bearing elements; and

at least one thermally-conductive structure in thermal communication with the support ring and in thermal communication with at least one of the substrates of the plurality of superhard bearing elements, the at least one thermally-conductive structure having a higher thermal conductivity than the support ring.

Assignments (5)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →