Controlled release, wood preserving composition with low-volatile organic content for treating in-service utility poles, posts, pilings, cross-ties and other wooden structures
View Patent ↗Disclosed herein are compositions comprising a dispersion of solid particles of a substantially insoluble copper compound in an amount from 0.001% to 10% by weight of the composition; a boron-containing compound, a fluoride-containing compound, or a combination thereof; and an aqueous carrier; wherein the composition has a viscosity of 125 to 425 tenths of a millimeter (tmm) as measured using a penetrometer, and wherein at least 20% of the particles of the composition comprise particles having particle size greater than 25 microns. Also disclosed herein are methods of making and using the same.
1. An aqueous wood preservative paste composition comprising:
a dispersion of solid particles of a substantially insoluble copper compound in an amount from 0.001% to 10% by weight of the paste composition;
a boron-containing compound, a fluoride-containing compound, or a combination thereof; and
an aqueous carrier;
wherein the paste composition has a viscosity of 125 to 425 tenths of a millimeter (tmm) as measured using a penetrometer, and
wherein at least 20% of the particles of the paste composition comprise particles having particle size greater than 25 microns.
2. The aqueous wood preservative paste composition of claim 1 , wherein at least 30% of the particles of the paste composition comprise particles having particle size greater than 25 microns.
3. The aqueous wood preservative paste composition of claim 1 , wherein less than 20% of the particles of the paste composition comprise particles having particle size greater than 100 microns.
4. The aqueous wood preservative paste composition of claim 1 , wherein the paste composition contains from 1% to 5% copper atoms by weight of the paste composition.
5. The aqueous wood preservative paste composition of claim 1 , wherein the copper compound comprises copper hydroxide, cupric oxide, cuprous oxide, copper carbonate, basic copper carbonate, copper oxychloride, dimethyldithiocarbamate, copper omadine, copper borate, or a combination thereof.
6. The aqueous wood preservative paste composition of claim 1 , wherein the boron-containing compound comprises a boric acid, a metal borate, a sodium borate, a potassium borate, or a combination thereof.
7. A method for remedial treatment of wood, comprising applying the paste composition of claim 1 to a wooden structure.
8. The method of claim 7 , wherein the wooden structure is an in-service wood product.
9. The method of claim 7 , wherein the paste composition is applied onto or into the wooden structure.
10. The method of claim 8 , wherein the in-service wood product is a utility pole, a railroad tie, or a wooden bridge.
11. A method comprising blending solid particles of a substantially insoluble copper compound; a boron-containing compound, a fluoride-containing compound, or a combination thereof; and an aqueous carrier to produce a paste composition, wherein at least 20% of the particles of the paste composition comprise particles having particle size greater than 25 microns.
12. The method of claim 11 , wherein at least 30% of the particles of the paste composition comprise particles having particle size greater than 25 microns.
13. The method of claim 11 , wherein the paste composition contains from 1% to 5% copper atoms by weight of the paste composition.
14. The method of claim 11 , wherein the copper compound comprises copper hydroxide, cupric oxide, cuprous oxide, copper carbonate, basic copper carbonate, copper oxychloride, dimethyldithiocarbamate, copper omadine, copper borate, or a combination thereof.
15. The method of claim 11 , wherein the boron-containing compound comprises a boric acid, a metal borate, a sodium borate, a potassium borate, or a combination thereof.
16. A method of delivering a fungitoxic amount of copper ion to an interior portion of a wooden product comprising:
applying an aqueous wood preservative paste composition comprising a dispersion of solid particles of a substantially insoluble copper compound in an amount of 0.001% to 10% by weight of the paste composition; a boron-containing compound, a fluoride-containing compound, or a combination thereof; and an aqueous carrier,
wherein the paste composition has a viscosity of between 125 and 425 tenths of a millimeter (tmm) as measured using a penetrometer;
wherein at least 30% of the particles of the paste composition comprise particles having particle size greater than 25 microns; and
wherein applying the paste composition to the wooden structure produces penetration of copper ions into an interior portion of the wooden structure to a fungicidally effective level.
17. The method of claim 16 , wherein at least 40% of the particles of the paste composition comprise particles having particle size greater than 25 microns.
18. The method of claim 16 , wherein the paste composition contains from 1% to 5% copper atoms by weight of the paste composition.
19. The method of claim 16 , wherein the copper compound comprises copper hydroxide, cupric oxide, cuprous oxide, copper carbonate, basic copper carbonate, copper oxychloride, dimethyldithiocarbamate, copper omadine, copper borate, or a combination thereof.
20. The method of claim 16 , wherein the boron-containing compound comprises a boric acid, a metal borate, a sodium borate, a potassium borate, or a combination thereof.