Semiconductor device and method for manufacturing same
According to one embodiment, a stacked body includes a plurality of metal layers stacked with an insulator interposed. A semiconductor body extends in a stacking direction through the stacked body. A charge storage portion is provided between the semiconductor body and one of the metal layers. A metal nitride film has a first portion and a second portion. The first portion is provided between the charge storage portion and one of the metal layers. The second portion is thicker than the first portion and is provided between one of the metal layers and the insulator.
1. A semiconductor device, comprising:
a foundation layer;
a stacked body provided above the foundation layer, the stacked body including a plurality of metal layers stacked with an insulator interposed, the metal layers functioning as control gates of memory cells;
a semiconductor body extending in a stacking direction through the stacked body;
a charge storage portion provided between the semiconductor body and one of the metal layers; and
a metal nitride film having a first portion and a second portion, the first portion being provided between the charge storage portion and one of the metal layers, the second portion being thicker than the first portion and being provided between one of the metal layers and the insulator.
2. The semiconductor device according to claim 1 , further comprising a metal oxide film provided between the charge storage portion and one of the metal layers, the metal oxide film including at least one of zirconium or hafnium.
3. The semiconductor device according to claim 2 , wherein the metal nitride film includes at least one of titanium nitride, titanium silicide nitride, tantalum nitride, tantalum silicide nitride, tungsten nitride, tungsten silicide nitride, molybdenum nitride, or molybdenum silicide nitride.
4. The semiconductor device according to claim 2 , wherein the insulator is a silicon oxide layer.
5. The semiconductor device according to claim 2 , wherein the metal layers include at least one of tungsten or molybdenum.
6. The semiconductor device according to claim 5 , wherein the metal layers include fluorine.
7. The semiconductor device according to claim 5 , wherein the metal nitride film is a titanium nitride film.
8. The semiconductor device according to claim 7 , wherein the titanium nitride film includes chlorine.
9. The semiconductor device according to claim 8 , wherein
the titanium nitride film includes a first film and a second film, a chlorine concentration of the second film being higher than a chlorine concentration of the first film,
the first film is provided to be continuous on an upper surface of one of the metal layers, a lower surface of one of the metal layers, and a side surface of one of the metal layers on the metal oxide film side, and
the second film is provided between the first film and the insulator.
10. The semiconductor device according to claim 9 , wherein the first portion does not include the second film.
11. The semiconductor device according to claim 2 , further comprising a first silicon oxide film provided between the metal oxide film and the charge storage portion.
12. The semiconductor device according to claim 2 , further comprising a second silicon oxide film provided between the charge storage portion and the semiconductor body.
13. The semiconductor device according to claim 2 , wherein the metal oxide film extends to be continuous along the stacking direction.