IP Library Granted Patent US 10,126,656
Granted Patent B2
US 10,126,656 · App. 15/259,400 · Granted Nov 13, 2018

Apparatus and methods of electrically conductive optical semiconductor coating

Inventor: Bradley Dean Schwartz (Brewster, NY)
Assignee: Goodrich Corporation
G03F7/32C23C14/48G02B1/11G02B1/14G03F7/20H01L23/552H01L31/0216
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,126,656
App. No.
15/259,400
Granted
Nov 13, 2018
Kind
B2
Abstract

A method of coating an optical substrate with a transparent, electrically conductive coating includes depositing a semiconductor coating over a surface of an optical substrate, wherein the semiconductor coating has broadband optical transmittance. A doped semiconductor is applied in a pattern over the semiconductor coating. The doped semiconductor in the pattern is activated for electrical conductivity in the doped semiconductor.

Claims (25)

1. A method of coating an optical substrate, comprising:

depositing a semiconductor coating over a surface of an optical substrate, wherein the semiconductor coating has broadband optical transmittance, wherein the semiconductor coating has broadband optical transmittance in at least visible and infrared spectra; and

doping portions of the semiconductor coating to form a pattern of doped semiconductor in the semiconductor coating, wherein the pattern is configured to provide electromagnetic interference (EMI) shielding to the optical substrate.

2. A method as recited in claim 1 , wherein doping the semiconductor coating to form a pattern includes:

applying a photoresist over the semiconductor coating;

selectively exposing the photoresist;

developing the photoresist in the pattern;

doping the semiconductor coating through openings in the photoresist; and

removing the photoresist to leave the doped semiconductor in the pattern on the semiconductor coating.

3. A method as recited in claim 1 , wherein the pattern includes a grid.

4. A method as recited in claim 1 , further comprising applying a protective coating over the semiconductor coating and doped semiconductor before activating the doped semiconductor.

5. A method as recited in claim 4 , further comprising depositing a broadband anti-reflection coating over the protective coating.

6. A method as recited in claim 1 , further comprising depositing a broadband anti-reflection coating over the semiconductor coating and doped semiconductor.

7. A method as recited in claim 1 , wherein activating the doped semiconductor includes at least one of heat-treating or laser annealing the doped semiconductor.

8. A method as recited in claim 1 , wherein the semiconductor coating includes at least one of In 2 O 3 or ZnO.

9. A method as recited in claim 1 , wherein doping the semiconductor to form a pattern includes at least one of applying dopant by ion implantation or applying dopant by thin film coating.

10. A method as recited in claim 1 , wherein the doped semiconductor includes at least one of Sn, Mo, W, Ti, Al, or Ga.

11. A method as recited in claim 1 , wherein depositing the semiconductor coating includes depositing the semiconductor coating with the semiconductor coating undoped.

12. A method as recited in claim 1 , wherein doping the semiconductor coating and activating the doped semiconductor include diffusing the doped semiconductor through the semiconductor coating to the optical substrate.

13. A method as recited in claim 1 , wherein depositing a semiconductor coating includes depositing the semiconductor coating over a surface of the optical substrate in its entirety.

14. A method as recited in claim 1 , wherein doping the semiconductor coating to form a pattern includes doping a surface of the semiconductor coating so a surface of the semiconductor coating is covered in its entirety with the pattern.

15. A method as recited in claim 1 , wherein the activated doped semiconductor, semiconductor coating, and optical substrate are formed into a window without etching.

16. A method as recited in claim 1 , wherein the activated doped semiconductor, semiconductor coating, and optical substrate are formed into a window without polishing or post-process planarization.

17. A method as recited in claim 1 , wherein the activated doped semiconductor and semiconductor coating have closely matched indices of refraction to mitigate light scattering.

18. A method as recited in claim 1 , further comprising making the doped semiconductor electrically conductive.

Assignments (3)
ASSIGNMENT AND ASSUMPTION AGREEMENT AND BILL OF SALE Recorded Sep 2, 2020
From: GOODRICH CORPORATION; RAYTHEON TECHNOLOGIES CORPORATION
To: DANBURY MISSION TECHNOLOGIES, LLC (FORMERLY KNOWN AS AMERGINT EO SOLUTIONS, LLC)
Reel/Frame 053680/0799 →
PATENT SECURITY AGREEMENT Recorded Sep 1, 2020
From: DANBURY MISSION TECHNOLOGIES, LLC; TETHERS UNLIMITED, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053663/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2016
From: SCHWARTZ, BRADLEY D., MR.
To: GOODRICH CORPORATION
Reel/Frame 039699/0141 →
Continuity (1)
Related Publication 20180070485A1 · Mar 8, 2018
Cited By (1)
US 12,399,430