Method for manufacturing solar cell module
A solar cell module and a method for manufacturing the same are disclosed. The solar cell module includes solar cells each including a semiconductor substrate, and first electrodes and second electrodes extending in a first direction on a surface of the semiconductor substrate, conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate and connected to the first electrodes or the second electrodes through a conductive adhesive, and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and fixing the conductive lines to the semiconductor substrate and the first and second electrodes. The insulating adhesive portion is attached up to an upper part and a side of at least a portion of each conductive line.
1. A method for manufacturing a solar cell module, the method comprising:
applying a conductive adhesive to a portion of each of first electrodes and second electrodes, the first electrodes and the second electrodes extending in a first direction on a surface of a semiconductor substrate and having different polarities;
disposing conductive lines to extend in a second direction crossing the first direction and to overlap the portion of the each of the first electrodes and the second electrodes, to which the conductive adhesive is applied;
attaching an insulating adhesive portion extending in the first direction to the semiconductor substrate and a portion of each conductive line; and
performing a lamination process on the semiconductor substrate, to which the insulating adhesive portion is attached,
wherein the performing of the lamination process includes softening and curing the insulating adhesive portion,
the insulating adhesive portion is attached on a back surface of at least the portion of each conductive line in the attaching of the insulating adhesive portion, and
the insulating adhesive portion is further attached on a side surface of the at least the portion of the each conductive line while the insulating adhesive portion is softened and cured.
2. The method of claim 1 , wherein the lamination process is performed at one temperature between 160° C. and 170° C.
3. The method of claim 1 , wherein a melting point of the insulating adhesive portion is lower than a temperature of the lamination process.
4. The method of claim 1 , wherein the insulating adhesive portion is an insulating tape comprising an adhesive on a surface of a base film.
5. The method of claim 4 , wherein the base film includes a polyolefin material.
6. The method of claim 4 , wherein melting points of the base film and the adhesive are lower than a temperature of the lamination process.
7. The method of claim 1 , wherein the performing of the lamination process includes filling the insulating adhesive portion, that is in a softened state, in at least a portion of an empty space between the conductive lines and the first electrodes and the second electrodes and then curing the insulating adhesive portion.