SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip, wherein the molded body comprises an array of molded structure elements, and first solder elements engaged with the molded structure elements.
1 . A method, comprising:
providing a semiconductor chip;
applying mold material over at least a portion of the semiconductor chip to mold a molded body;
generating at least one molded structure element on the molded body; and
applying solder over the molded structure element.
2 . The method according to claim 1 , wherein the molded structure element is generated during the molding of the molded body.
3 . The method according to claim 1 , wherein the of molded structure element is generated after the molding of the molded body.
4 . The method according to claim 1 , wherein the generating act generates a plurality of molded structure elements on the molded body, and the applying act applies solder over each of the plurality of molded structure elements.
5 . The method according to claim 4 , further comprising:
placing the semiconductor chip on a carrier, the carrier including at least one recess; and
filling the at least one recess with mold material to form the at least one molded structure element.
6 . The method according to claim 4 , wherein the applying act provides a molded body having a surface coplanar with a surface of the semiconductor chip.
7 . The method according to claim 6 , wherein the surface of the semiconductor includes at least one connection element.
8 . A method, comprising:
providing a plurality of semiconductor chips;
applying mold material over the plurality of semiconductor chips to mold a molded workpiece;
generating an array of molded structure elements on the molded workpiece; and
applying solder elements over the molded structure elements.
9 . The method according to claim 8 , wherein the array of molded structure elements is generated during the molding of the molded workpiece.
10 . The method according to claim 8 , wherein the array of molded structure elements is generated after the molding of the molded workpiece.
11 . The method according to claim 8 , further comprising applying a first layer over at least two of the semiconductor chips, the molded workpiece, and the molded structure elements.
12 . The method according to claim 8 , wherein the array of molded structure elements is generated in a mold form.
13 . The method according to claim 8 , wherein the applying act applies the mold material over three surfaces of four surfaces of each of the plurality of semiconductor chips.
14 . The method according to claim 8 , wherein applying act applies the mold material over surfaces of each of the plurality of semiconductor chips, excluding surfaces of the plurality of semiconductor chips that include connection elements.