CEM switching device
Subject matter herein disclosed relates to a method for the manufacture of a switching device comprising a silicon-containing correlated electron material. In embodiments, processes are described for forming the silicon-containing correlated electron material. These processes may use comparatively lower temperatures as compared to those used for forming a correlated electron material comprising a transition metal oxide.
1. A method for the manufacture of a CEM switching device, which method comprises:
forming a conductive substrate;
forming a layer of a silicon-containing correlated electron material (CEM) on or over the conductive substrate, the silicon-containing CEM layer comprising a d- or f-block metal silicate;
forming a conductive overlay on the silicon-containing CEM layer; and
forming a layer of a silicide and oxidizing the silicide to a silicate.
2. A method according to claim 1 , comprising forming the silicon-containing CEM layer with a silicon content between 1 atom % and 20 atom %.
3. A method according to claim 2 , comprising forming the silicon-containing CEM layer with a dopant content less than that of the silicon content.
4. A method according to claim 1 , wherein the silicon-containing CEM layer comprises a silicate of formula M x Si y O z :dopant wherein x, y and z are greater than zero.
5. A method according to claim 4 , wherein the forming of the CEM layer incorporates the dopant from an organic or inorganic metal precursor.
6. A method according claim 1 , comprising doping the silicide by exposure to a dopant from ambient atmosphere.
7. A method according to claim 1 , comprising doping the silicate by exposure to a dopant from ambient atmosphere.
8. A method according to claim 7 , wherein the oxidizing comprises a wet oxidation, a dry oxidation or a plasma oxidation.
9. A method according to claim 8 , wherein the oxidizing is carried out at a temperature less than 500° C.
10. A method according to claim 1 , wherein the forming of the silicon-containing CEM layer is carried out at a temperature less than 500° C.