Semiconductor manufacturing apparatus
A semiconductor manufacturing apparatus according to the present embodiment includes a first cooler, a second cooler, and a temperature controller. The first cooler includes a first placing portion that can place a central portion of a semiconductor substrate thereon, and cools the central portion by heat exchange with the first placing portion. The second cooler includes a second placing portion that can place a peripheral portion of the semiconductor substrate thereon in a periphery of the first placing portion, and cools the peripheral portion. The temperature controller controls a temperature of the second placing portion to be lower than a temperature of the semiconductor substrate and to be higher than a temperature of the first placing portion.
1. A semiconductor manufacturing apparatus comprising:
a first placing portion having a circular shape in a plan view, having a flat surface and being formed of metal; and
a second placing portion having an annular shape that is concentric to the first placing portion in a plan view, being in a periphery of the first placing portion, being separated from the first placing portion, having a flat surface, being formed of metal and having a same height as the first placing portion; and
a temperature controller, wherein
an inner circumferential surface of the second placing portion is in contact with an outer circumferential surface of the first placing portion,
a seam is present between the first placing portion and the second placing portion, the seam being visible in a plan view, the seam comprising the first placing portion and the second placing portion directly adjacent to each other,
a first channel is disposed along an outer peripheral edge of the first placing portion,
a second channel is disposed along at least one of an inner peripheral edge and an outer peripheral edge of the second placing portion, and
the temperature controller controls a temperature of a first fluid flowing to the first channel and a second fluid flowing to the second channel, supplies a first refrigerant to the first channel and supplies a second refrigerant at a higher temperature than the first refrigerant to the second channel.
2. The apparatus of claim 1 , wherein
the first channel passes through the outer circumferential surface of the first placing portion and the inner circumferential surface of the second placing portion, and is exposed to an outside of the first placing portion and the second placing portion from the outer circumferential surface of the second placing portion, and the second channel is exposed to the outside of the first placing portion and the second placing portion from a side surface of the second placing portion.
3. The apparatus of claim 1 , wherein a radius of the first placing portion is in a range of 50-130 mm.