Semiconductor manufacturing method and semiconductor device
A semiconductor manufacturing method includes forming a first film on an upper surface of a substrate. The semiconductor manufacturing method includes forming concave portions extending from an upper surface of the first film to below the upper surface of the substrate. The method includes forming a second film from bottom surfaces of the concave portions to a first position in the concave portions between the upper surface of the first film and the upper surface of the substrate. The method includes forming a third film in the concave portions to cover side walls of the concave portions and an upper surface of the second film. The method includes grinding the third film to expose the second film. The method includes removing the second film. The method includes forming a fourth film from the bottom surfaces of the concave portions to at least a lower surface of the third film.
1. A semiconductor manufacturing method comprising:
forming a first film on an upper surface of a substrate;
forming concave portions extending from an upper surface of the first film to below the upper surface of the substrate;
forming a second film from bottom surfaces of the concave portions to a first position in the concave portions between the upper surface of the first film and the upper surface of the substrate;
forming a third film in the concave portions to cover side walls of the concave portions and an upper surface of the second film,
grinding the third film to expose the second film;
removing the second film; and
forming a fourth film from the bottom surfaces of the concave portions to at least a lower surface of the third film.
2. The method of claim 1 , comprising forming a fifth film in the concave portions to cover side walls of the third film and an upper surface of the fourth film.
3. The method of claim 2 , wherein
forming of the second film comprises:
forming the second film from the bottom surfaces of the concave portions to at least the upper surface of the first film, and
grinding the second film to the first position.
4. The method of claim 2 , wherein the first film is a stack film having insulating films and silicon nitride films stacked alternately.
5. The method of claim 4 , wherein the first position is a position corresponding to an insulating film placed at a lower end in a stacking direction of the stack film.
6. The method of claim 4 , wherein the third film is a stack film including oxide films and nitride films.
7. The method of claim 4 , comprising replacing the silicon nitride films with conductive layers, respectively.
8. The method of claim 1 , wherein
forming of the second film comprises:
forming the second film from the bottom surfaces of the concave portions to at least the upper surface of the first film, and
grinding the second film to the first position.
9. The method of claim 1 , wherein the second film has a heatproof temperature higher than a process temperature of formation of the third film.
10. The method of claim 9 , wherein the second film includes carbon.
11. The method of claim 1 , wherein the fourth film is formed by epitaxial growth.
12. The method of claim 1 , wherein the fourth film includes a semiconductor or a conductor.
13. The method of claim 1 , wherein the third film is ground by etching using gas including fluorine and oxygen.
14. The method of claim 1 , wherein the first film is a stack film having insulating films and silicon nitride films stacked alternately.
15. The method of claim 14 , wherein the first position is a position corresponding to an insulating film placed at a lower end in a stacking direction of the stack film.
16. The method of claim 14 , wherein the third film is a stack film including oxide films and nitride films.
17. The method of claim 14 , comprising replacing the silicon nitride films with conductive layers, respectively.