METHOD OF MANUFACTURING GLASS SUBSTRATE WITH THROUGH HOLE, METHOD OF MANUFACTURING GLASS SUBSTRATE INCLUDING THROUGH ELECTRODE, AND METHOD OF MANUFACTURING INTERPOSER
Disclosed is a method of manufacturing a glass substrate with a through hole, the glass substrate having a thickness of θ f , the method including (1) adjusting a first thickness θ 1 of the glass substrate having first and second surfaces facing each other to be a second thickness θ 2 (θ 2 <θ 1 ); (2) forming one or more through holes in the glass substrate by irradiating a laser beam from the first surface of the glass substrate; and (3) wet-etching the glass substrate with the through hole to adjust a size of the through hole to be a predetermined size, so that the thickness of the glass substrate is adjusted from θ 2 to the target value of θ f .
1 . A method of manufacturing a glass substrate with a through hole, the glass substrate having a thickness of θ f , the method comprising:
(1) adjusting a first thickness θ 1 of the glass substrate having first and second surfaces facing each other to be a second thickness θ 2 (θ 2 <θ 1 );
(2) forming one or more through holes in the glass substrate by irradiating a laser beam from the first surface of the glass substrate; and
(3) wet-etching the glass substrate with the through hole to adjust a size of the through hole to be a predetermined size, so that the thickness of the glass substrate is adjusted from θ 2 to the target value of θ f .
2 . The method according to claim 1 , wherein in the adjusting (1), the glass substrate is wet etched.
3 . The method according to claim 2 , wherein same types of etchants are used for the adjusting (1) and for the wet-etching (3).
4 . The method according to claim 1 , further comprising, between the forming (2) and the wet-etching (3) :
(4) thermal processing the glass substrate with the through hole.
5 . The method according to claim 1 , wherein a difference between the first thickness θ 1 and the second thickness θ 2 is in a range from 5 μm to 500 μm.
6 . The method according to claim 1 , wherein, by the forming (2), the through hole is formed, the through hole including a first opening having a diameter of φ 1 on the first surface and a second opening having a diameter of φ 2 on the second surface,
wherein, by the wet-etching (3), the through hole is formed, the through hole including a third opening having a diameter of φ 3 on the first surface and a fourth opening having a diameter of φ 4 on the second surface, and
wherein, φ 3 >φ 1 , and φ 4 >φ 2 are satisfied.
7 . The method according to claim 6 , wherein, by the forming (2), a plurality of through holes are formed, and
wherein, in the wet-etching (3), when a center-to-center distance of two adjacent through holes is denoted by P, P−φ 3 >0 is satisfied.
8 . The method according to claim 6 , wherein a candidate of the thickness (θ 2 −θ f ) of the glass substrate, the thickness being adjusted at the wet-etching (3), is calculated from a target value of the diameter φ 4 of the fourth opening,
wherein a candidate of the second thickness θ 2 of the glass substrate obtained at the adjusting (1) is calculated from the target value θ f of the thickness of the glass substrate,
wherein the diameter φ 1 of the first opening obtained at the forming (2) is calculated,
wherein the diameter φ 3 of the third opening obtained at the wet-etching (3) is calculated,
wherein the diameter φ 2 of the second opening obtained at the forming (2) is determined from the diameter φ 3 of the third opening, and
wherein the thickness of the glass substrate (θ 1 −θ 2 ), the thickness being adjusted at the adjusting (1), is calculated from the thickness (θ 2 −θ f ) of the glass substrate, the thickness being adjusted at the wet-etching (3), the first thickness θ 1 of the glass substrate, and the target value θ f of the thickness of the glass substrate.
9 . A method of manufacturing a glass substrate including a through electrode, the method comprising:
manufacturing the glass substrate with a through hole; and
forming the through electrode in the through hole,
wherein the glass substrate has a thickness of θ f , and the manufacturing the glass substrate with the through hole includes
(1) adjusting a first thickness θ 1 of the glass substrate having first and second surfaces facing each other to be a second thickness θ 2 (θ 2 <θ 1 ); (2) forming one or more through holes in the glass substrate by irradiating a laser beam from the first surface of the glass substrate; and
(3) wet-etching the glass substrate with the through hole to adjust a size of the through hole to be a predetermined size, so that the thickness of the glass substrate is adjusted from θ 2 to the target value of θ f .
10 . The method according to claim 9 , wherein in the adjusting (1), the glass substrate is wet etched. 30
11 . The method according to claim 10 , wherein same types of etchants are used for the adjusting (1) and for the wet-etching (3). 5
12 . A method of manufacturing an interposer, the method comprising:
manufacturing a glass substrate with a through hole; and
forming a through electrode in the through hole,
wherein the glass substrate has a thickness of θ f , and the manufacturing the glass substrate with the through hole includes
(1) adjusting a first thickness θ 1 of the glass substrate having first and second surfaces facing each other to be a second thickness θ 2 (θ 2 <θ 1 );
(2) forming one or more through holes in the glass substrate by irradiating a laser beam from the first surface of the glass substrate; and
(3) wet-etching the glass substrate with the through hole to adjust a size of the through hole to be a predetermined size, so that the thickness of the glass substrate is adjusted from θ 2 to the target value of θ f .
13 . The method according to claim 12 , wherein in the adjusting (1), the glass substrate is wet etched.
14 . The method according to claim 13 , wherein same types of etchants are used for the adjusting (1) and for the wet-etching (3).