Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
A gallium and nitrogen containing optical device has a base region and no more than three major planar side regions configured in a triangular arrangement provided from the base region.
1. A light emitting diode (LED) device made from the process comprising:
(a) overlaying an epitaxial structure on a substrate having planes to form a processed wafer, wherein said planes are non-m-planes;
(b) scribing said processed wafer to form scribe lines along at least a portion of said planes to define a plurality of triangular portions of said processed wafer; and
(c) singulating said triangular portions by breaking along said scribe lines to define an LED device having three sides along at least a portion of said planes of said substrate, wherein breaking creates a textured surface on one or more of said sides, wherein said textured surface comprises striations, said textured surface being configured to improve light extraction compared to a smooth surface.
2. The LED device of claim 1 , wherein said planes are a-planes.
3. The LED device of claim 2 , wherein said optical device comprises no more than five sides, wherein two sides of said five sides have a triangular shape and are configured from equivalent crystal planes.
4. The LED device of claim 3 , wherein said equivalent crystal planes are c-planes.
5. The LED device of claim 1 , wherein all of said three sides comprise said textured surface.
6. The LED device of claim 5 , wherein said three sides comprise said textured surface to facilitate a light extraction efficiency of over 80%.
7. The LED device of claim 1 , wherein said three sides are perpendicular to top and bottom sides of said LED device, and said striations are perpendicular to said top and bottom sides.
8. The LED device of claim 1 , wherein said substrate comprises bulk GaN.
9. The LED device of claim 8 , wherein said light-emitting epitaxial structure comprises GaN.
10. The LED device of claim 1 , wherein said optical device has only five sides.
11. A process of preparing a light emitting diode (LED) comprising:
(a) overlaying an epitaxial structure on a substrate having planes to form a processed wafer, wherein said planes are a-planes;
(b) scribing said processed wafer to form scribe lines along at least a portion of said planes to define a plurality of triangular portions of said processed wafer; and
(c) singulating said triangular portions by breaking along said scribe lines to define an LED device having three sides along at least a portion of said planes of said substrate, wherein breaking creates a textured surface on one or more of said sides, wherein said textured surface comprises striations, said textured surface being configured to improve light extraction compared to a smooth surface.
12. The process of claim 11 , wherein said optical device comprises no more than five sides, wherein two sides of said five sides have a triangular shape and are configured from equivalent crystal planes.
13. The process of claim 11 , wherein said three sides comprise said textured surface.
14. The process of claim 11 , wherein said three sides are perpendicular to top and bottom sides of said process, and said striations are perpendicular to said top and bottom sides.
15. The process of claim 11 , wherein said substrate comprises bulk GaN.
16. The process of claim 15 , wherein said light-emitting epitaxial structure comprises GaN.