IP Library Granted Patent US 10,126,530
Granted Patent B2
US 10,126,530 · App. 15/271,288 · Granted Nov 13, 2018

Fabrication of optical elements and modules incorporating the same

Inventors: Simon Gubser (Weesen, CH); Hakan Karpuz (Au, CH)
Assignee: Heptagon Micro Optics Pte. Ltd.
G02B13/0085G02B3/0031G02B5/005H01L27/14625H01L27/14627H01L27/14685H01L31/02325H01L31/02327H01L33/58H01L51/5275H01S5/005G02B5/1852
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,126,530
App. No.
15/271,288
Granted
Nov 13, 2018
Kind
B2
Abstract

Fabricating a wafer-scale spacer/optics structure includes replicating optical replication elements and spacer replication sections directly onto an optics wafer (or other wafer) using a single replication tool. The replicated optical elements and spacer elements can be composed of the same or different materials.

Claims (11)

1. An opto-electronic module comprising:

an opto-electronic device mounted on a substrate;

an optics member over the opto-electronic device, wherein the optics member includes a solid transparent portion and a light blocking portion, the light blocking portion laterally surrounding sidewalls of the solid transparent portion;

a replicated spacer member on a surface of the light blocking portion of the optics member, wherein the replicated spacer member separates the substrate and opto-electronic device from the optics member; and

a replicated optical element disposed directly on a surface of the solid transparent portion of the optics member, the replicated optical element being substantially aligned with the opto-electronic device and disposed in an area between the transparent portion of the optics member and the substrate,

wherein the replicated optical element is composed of a first cured material and the replicated spacer member is composed of a second different cured material, and

wherein some of the first cured material of the replicated optical element is in direct contact with second cured material of the replicated spacer member.

2. The opto-electronic module of claim 1 wherein the first cured material of the replicated optical element abuts a side surface of the second cured material of the replicated spacer member.

3. The opto-electronic module of claim 1 wherein the first cured material of the replicated optical element is present along at least part of an interface between the replicated spacer member and the optics member.

4. The opto-electronic module of claim 1 wherein the replicated optical element includes a lens structure and wherein the replicated spacer member is substantially non-transparent.

5. The opto-electronic module of claim 1 wherein no bond line is visible between the first cured material of the replicated optical element and the second cured material of the replicated spacer member.

Assignments (3)
CHANGE OF NAME Recorded Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →
CHANGE OF NAME Recorded Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 048289/0147 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2016
From: GUBSER, SIMON; KARPUZ, HAKAN
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 039813/0078 →
Continuity (3)
Division 14140712 · Dec 26, 2013
Provisional Application 61746347 · Dec 27, 2012
Related Publication 20170010450A1 · Jan 12, 2017