Embedded die-down package-on-package device
An apparatus including a die; and a build-up carrier including alternating layers of conductive material and dielectric material disposed on a device side of the die and dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at a gradation between the device side of the die and the embedded thickness dimension of the die and configured for connecting the carrier to a substrate. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; forming a build-up carrier adjacent a device side of a die, wherein the build-up carrier includes a dielectric material defining a gradation between the device side of the die and a backside of the die, the gradation including a plurality of carrier contact points; and separating the die and the carrier from the sacrificial substrate.
1. A method comprising:
disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate;
disposing a spacer layer on the sacrificial substrate, the spacer layer comprising an opening to accommodate the die on the sacrificial substrate;
forming a build-up carrier adjacent a device side of the die, wherein the build-up carrier comprises:
a plurality of alternating layers of conductive material and dielectric material, and
dielectric material embedding a portion of a thickness dimension of the die and defining a gradation between the device side of the die and a backside of the die, the gradation comprising a plurality of carrier contact points configured for mounting the build-up carrier to the substrate; and
after forming the build-up carrier, separating the die and the build-up carrier from the sacrificial substrate and the spacer layer.
2. The method of claim 1 , wherein the spacer layer has a thickness equivalent to a thickness of the gradation and the opening in the spacer layer comprises an opening to accommodate the dielectric material to embed a portion of the thickness dimension of the die.
3. The method of claim 2 , wherein forming the build-up carrier comprises forming the plurality of carrier contact points on the spacer layer.
4. The method of claim 3 , wherein the plurality of carrier contact points are configured for connection of the build-up carrier to a printed circuit board.
5. A method comprising:
disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate;
forming a build-up carrier adjacent the device side of the die, wherein the build-up carrier comprises:
a plurality of alternating layers of conductive material and dielectric material, and
dielectric material embedding a portion of a thickness dimension of the die and defining a first gradation between the device side of the die and a backside of the die, the first gradation comprising a plurality of carrier contact points configured for mounting the build-up carrier to the substrate; and
separating the die and the build-up carrier from the sacrificial substrate,
wherein forming the build-up carrier comprises:
patterning a penultimate layer of the plurality of conductive layers and forming a spacer layer on the patterned penultimate layer, the spacer layer comprising an opening to accommodate an ultimate layer of the plurality of conductive layers, the spacer layer having a thickness equivalent to a thickness of a second gradation;
patterning the ultimate layer of the plurality of conductive layers; and
after forming the build-up carrier, removing the spacer layer.
6. The method of claim 5 , wherein forming the build-up carrier comprises disposing dielectric material on the patterned ultimate layer of the plurality of conductive layers.
7. The method of claim 5 , patterning the penultimate layer of the plurality of conductive layers comprises patterning the penultimate layer into the second plurality of carrier contact points configured for connection of the build-up carrier to a secondary device or package.