DAMPENED PRESSURE PORT
Sensor assemblies and related components and methods are disclosed. In some instances, the sensor assemblies include a sensor mounting body and a porous member. The porous member can be disposed within an aperture that extends through a sensor mounting body. The porous member may function as a dampening element or snubber that impedes the propagation of one or more pressure waves across the aperture. Some assemblies may include a metallized layer.
1 . A sensor assembly comprising:
a monolithic sensor mounting body comprising:
a first flat surface;
a second flat surface disposed opposite the first flat surface;
a protrusion extending from the second flat surface and away from the first flat surface; and
an aperture that extends across the sensor mounting body from an opening in the first flat surface to an opening in the protrusion;
a porous member disposed within the aperture such that the first opening is in fluid communication with the second opening through fluid communication across the porous member;
a metallized layer disposed on at least a portion of the first flat surface of the sensor mounting body; and
a pressure sensor that is coupled to the first flat surface such that the pressure sensor is in fluid communication with the aperture.
2 . The sensor assembly of claim 1 , wherein the monolithic sensor mounting body is formed from a fluid-impermeable ceramic material.
3 . The sensor assembly of claim 1 , wherein the metallized layer is configured for electrical communication with the pressure sensor.
4 . The sensor assembly of claim 1 , further comprising an integrated circuit that is mounted to the first flat surface of the sensor mounting body.
5 . The sensor assembly of claim 4 , wherein the pressure transducer is disposed between the first flat surface and the integrated circuit.
6 . The sensor assembly of claim 5 , wherein the pressure transducer is electrically coupled to the integrated circuit via a first plurality of leads and the integrated circuit is electrically coupled to electrical contacts on the sensor mounting body via a second plurality of leads.
7 . The sensor assembly of claim 1 , wherein the porous member comprises a ceramic material.
8 . The sensor assembly of claim 1 , wherein the porous member comprises a polymeric material.
9 . The sensor assembly of claim 1 , wherein the porous member comprises sintered metal.
10 . The sensor assembly of claim 1 , wherein the porous material couples to the sensor mounting body by an interference fit.
11 - 29 . (canceled)
30 . A method of forming a sensor assembly, the method comprising:
integrally forming a sensor mounting body, the sensor mounting body comprising:
a flat portion defining a first side and a second side;
a protrusion extending from the second side of the flat portion, the protrusion integrally formed with the flat portion; and
an aperture extending from a surface of the protrusion to the first side of the flat portion; and
securing a porous member within the aperture of the sensor mounting body.
31 . The method of claim 30 , further comprising coupling a sensor to the first side of the flat portion, such that a portion of the sensor is in fluid communication with the aperture.
32 - 34 . (canceled)
35 . The method of claim 30 , wherein integrally forming the sensor mounting body comprises forming the sensor mounting body from a continuous ceramic material.
36 . The method of claim 30 , wherein integrally forming the sensor mounting body comprises injection-molding the sensor mounting body.
37 . (canceled)
38 . The method of claim 30 , further comprising applying a metallized layer to at least a portion of the first side of the flat portion.
39 . The method of claim 30 , further comprising heating the sensor mounting body, thereby causing the sensor mounting body to contract around the porous member.
40 - 41 . (canceled)
42 . The method of claim 30 , wherein securing a porous member within the aperture of the sensor mounting body comprises securing the porous member within the aperture of the sensor mounting body via an interference fit.
43 . A sensor assembly comprising:
a sensor mounting body;
an aperture extending through the sensor mounting body to form a first opening on a first side of the sensor mounting body and a second opening on a second side of the sensor mounting body that is opposite of the first side of the sensor mounting body; and
a porous member disposed within the aperture such that the first opening is in fluid communication with the second opening through fluid communication across the porous member.
44 . The sensor assembly of claim 43 , wherein:
the sensor mounting body comprises a protrusion; and
the aperture extends through a portion of the protrusion.
45 - 48 . (canceled)
49 . The sensor assembly of claim 43 , wherein the porous member comprises a ceramic material.
50 . The sensor assembly of claim 43 , wherein the porous member comprises a polymeric material.
51 . The sensor assembly of claim 43 , wherein the porous member couples to the sensor mounting body by an interference fit.
52 . The sensor assembly of claim 43 , further comprising a pressure sensor coupled to the first side of the sensor mounting body.
53 . The sensor assembly of claim 43 , further comprising a metallized layer disposed on at least a portion of the sensor mounting body.
54 - 69 . (canceled)