IP Library Granted Patent US 10,290,400
Granted Patent B2
US 10,290,400 · App. 15/279,344 · Granted May 14, 2019

Method of producing a cermet-containing bushing for an implantable medical device

Inventors: Jens Troetzschel (Ronneburg, DE); Heiko Specht (Hanau, DE)
Assignee: Heraeus Deutschland GmbH & Co. KG
H01B17/306A61N1/3754H01B13/0036H01B19/00H05K3/30Y10T29/4913Y10T29/49227
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Quick Facts
Patent No.
US 10,290,400
App. No.
15/279,344
Granted
May 14, 2019
Kind
B2
Abstract

One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes forming a holding element for holding the electrical bushing in the implantable medical device, the holding element including a through-opening. An insulation element of aluminum oxide is formed within the through-opening. At least one elongated conduction element is formed extending through insulation element. The at least one elongated conduction element includes an aluminum oxide in a metallic matrix. The insulation element and the at least one elongated conduction element are jointly fired thereby forming a hermetic seal therebetween without welding or soldering.

Claims (20)

1. A method for producing an electrical bushing for an implantable medical device, the method comprising:

forming a holding element for holding the electrical bushing in the implantable medical device, the holding element comprising a through-opening;

forming an insulation element comprising aluminum oxide within the through-opening;

forming at least one elongated conduction element extending through insulation element, the at least one elongated conduction element comprising an aluminum oxide in a metallic matrix; and

jointly firing the insulation element and the at least one elongated conduction element thereby forming a hermetic seal therebetween without welding or soldering;

wherein prior to jointly firing the insulation element and the at least one elongated conduction element and prior to forming the at least one elongated conduction element extending through the insulation element, partially sintering at least one of the insulation element and the at least one elongated conduction element to achieve a surface hardness such that handling the conduction element or insulation element is improved.

2. The method according to claim 1 , wherein forming the insulation element further comprises generating an insulation element green compact for forming the insulation element and wherein forming the at least one elongated conduction element comprises forming at least one cermet-containing conduction element green compact for forming the conduction element.

3. The method according to claim 2 , wherein jointly firing the insulation element and the at least one elongated conduction element comprises jointly firing the insulation element green compact and the conduction element green compact.

4. The method according to claim 1 , wherein the holding element comprises a cermet.

5. The method of claim 1 further comprising forming the conduction element and the holding element from the same material.

6. A method for producing an implantable medical device, the method comprising:

forming a holding element for holding an electrical bushing in the implantable medical device, the holding element comprising a through-opening;

forming an insulation element comprising aluminum oxide within the through-opening;

forming at least one elongated conduction element extending through insulation element, the at least one elongated conduction element comprising an aluminum oxide in a metallic matrix; and

jointly firing the insulation element and the at least one elongated conduction element thereby forming a hermetic seal therebetween without welding or soldering;

wherein prior to jointly firing the insulation element and the at least one elongated conduction element and prior to forming the at least one elongated conduction element extending through the insulation element, partially sintering at least one of the insulation element and the at least one elongated conduction element to achieve a surface hardness such that handling the conduction element or insulation element is improved.

7. The method according to claim 6 , wherein forming the insulation element further comprises generating an insulation element green compact for forming the insulation element and wherein forming the at least one elongated conduction element comprises forming at least one cermet-containing conduction element green compact for forming the conduction element.

8. The method according to claim 7 , wherein jointly firing the insulation element and the at least one elongated conduction element comprises jointly firing the insulation element green compact and the conduction element green compact.

9. The method according to claim 6 , wherein the holding element comprises a cermet.

10. The method of claim 6 further comprising forming the conduction element and the holding element from the same material.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2024
From: HERAEUS DEUTSCHLAND GMBH & CO. KG
To: HERAEUS MEDEVIO GMBH & CO. KG
Reel/Frame 068189/0526 →
MERGER Recorded Jun 28, 2024
From: HERAEUS PRECIOUS METALS GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 068377/0925 →
Priority Claims (1)
DE 10 2009 035 972 · Aug 4, 2009 · national
Continuity (3)
Division 14171275 · Feb 3, 2014
Division 12850406 · Aug 4, 2010
Related Publication 20170018337A1 · Jan 19, 2017
Cited By (2)
US 12,344,566 US 12,679,783