Light emitting device package
A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.
1. A light emitting device package comprising:
a light emitting structure comprising a plurality of light emitting regions configured to emit light, respectively;
a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively;
a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and
an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another,
wherein the light emitting regions comprises first, second and third light emitting regions,
wherein the isolation insulating layer comprises a first isolation insulating layer insulating the first light emitting region from the second light emitting region, and a second isolation insulating layer insulating the second light emitting region from the third light emitting region, and
wherein the isolation insulating layer forms a continuous structure with respect to the light emitting regions such that the first isolation insulating layer and the second isolation insulating layer are connected to each other.
2. The light emitting device package of claim 1 , wherein each of the light adjusting layers comprises a wavelength conversion layer configured to convert a wavelength of the light emitted from a corresponding light emitting region among the light emitting regions.
3. The light emitting device packet of claim 2 , wherein the light emitted from the light emitting regions have a same wavelength, and
wherein the wavelength conversion layers are configured to convert the wavelength of the light differently.
4. The light emitting device package of claim 2 , wherein each of the light adjusting layers further comprises a filter layer disposed above the wavelength conversion layer, and configured to selectively block the light of which the wavelength is converted at the wavelength conversion layer.
5. The light emitting device package of claim 4 , further comprising a glass layer disposed above the light adjusting layers.
6. The light emitting device package of claim 5 , wherein the glass layer comprises a concave and convex structure disposed on an upper surface of the glass layer.
7. The light emitting device package of claim 1 , wherein each of the light emitting regions comprises a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, and
wherein the electrodes comprise:
a plurality of first connection electrodes respectively connected to the first conductivity-type semiconductor layers of the light emitting regions; and
a second connection electrode commonly connected to the second conductivity-type semiconductor layers of the light emitting regions.
8. The light emitting device package of claim 7 , wherein the electrodes further comprises:
a plurality of first electrode pads respectively connected to the first connection electrodes; and
a second electrode pad connected to the second connection electrode,
wherein a number of the first electrode pads is equal to a number of the light emitting regions, and
wherein at least two of the first electrode pads are disposed below a same light emitting region among the light emitting regions.
9. The light emitting device package of claim 8 , wherein one of the plurality of first electrode pads and the second electrode pad are disposed below a same light emitting region among the light emitting regions.
10. The light emitting device package of claim 8 , wherein the first connection electrode connected to the first conductivity-type semiconductor layer of one of the light emitting regions is extended below another of the light emitting region, and connected to one of the at least two first electrode pads.
11. The light emitting device package of claim 10 , wherein a plan view structure of the light emitting device package takes a quadrangle form, and
wherein the first electrode pads and the second electrode pad are disposed close to vertices of the light emitting device package in the plan view, respectively.
12. The light emitting device package of claim 1 , further comprising a partition disposed above the isolation insulating layer and between the light adjusting layers, and configured to prevent the light emitted through the light adjusting layers from interfering one another,
wherein the partition forms a continuous structure with respect to the light adjusting layers.
13. The light emitting device package of claim 12 , wherein a portion of the isolation insulating layer is inserted into a bottom of the partition.
14. The light emitting device package of claim 12 , wherein each of the light emitting regions comprises a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, and
wherein the electrodes comprise:
a plurality of first connection electrodes respectively connected to the first conductivity-type semiconductor layers of the light emitting regions; and
a second connection electrode commonly connected to the second conductivity-type semiconductor layers of the light emitting regions, and
wherein a portion of the second connection electrode is disposed between light emitting regions and below the partition.
15. The light emitting device package of claim 1 , further comprising a buffer layer disposed between the light emitting structure and the plurality of light adjusting layers.
16. The light emitting device package of claim 15 , wherein a portion of the isolation insulating layer is inserted into the buffer layer.
17. A light emitting device package comprising:
a light emitting structure comprising a plurality of light emitting regions configured to emit light, respectively;
a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively;
a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and
an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions,
wherein the isolation insulating layer extends below a bottom of each of the light emitting regions.
18. A light emitting device package comprising:
a light emitting structure comprising a plurality of light emitting regions configured to emit light, respectively;
a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively;
a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and
an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions,
wherein the isolation insulating layer comprises a plurality of insulating layers having different refractive indices.
19. The light emitting device package of claim 18 , wherein the isolation insulating layer comprises side insulation portions disposed between the light emitting regions, and
wherein top surfaces of the side insulation portions are connected to one another through a buffer layer disposed between the light emitting structure and the light adjusting layers.
20. The light emitting device package of claim 19 , wherein the buffer layer is a layer which was provided on a substrate on which the light emitting structure is grown, the substrate being removed after the light emitting structure is divided into the light emitting regions and before the light adjusting layers are disposed above the light emitting regions.
21. The light emitting device package of claim 19 , wherein the buffer layer comprises a high resistance material which prevents the light emitting regions from being electrically connected to one another.
22. The light emitting device package of claim 20 , wherein the buffer layer comprises AN, AlGaN, or InGaN.