Systems, devices and methods of using a conductive housing for a battery contact
View Patent ↗A device includes a housing constructed from a conductive material, and an electronic circuit electrically insulated from the housing. The device also includes a power source positioned such that a first electrical contact of the power source faces the electronic circuit and a second electrical contact faces a side of the housing. The device also includes an insulating layer that includes a first aperture and a second aperture. The device also includes a first connector configured for electrically coupling the electronic circuit and the first electrical contact, and a second connector configured for electrically coupling the electronic circuit and the side of the housing via the first aperture of the insulating layer. The power source is configured for electrically coupling the second electrical contact with the side of the housing via the second aperture of the insulating layer.
1. A device, comprising:
a housing constructed from a conductive material;
an electronic circuit electrically insulated from the housing;
a power source disposed between the electronic circuit and a side of the housing, the power source positioned such that a first electrical contact of the power source faces the electronic circuit, and such that a second electrical contact of the power source faces the side of the housing;
an insulating layer disposed on the housing, the insulating layer including a first aperture and a second aperture formed therein;
a first connector configured for electrically coupling the electronic circuit and the first electrical contact; and
a second connector configured for electrically coupling the electronic circuit and the side of the housing via the first aperture of the insulating layer,
the power source configured for electrically coupling the second electrical contact with the side of the housing via the second aperture of the insulating layer, such that the second electrical contact is conductively coupled to the electronic circuit via the housing and the second connector for complete electrical interconnection between the power source and the electronic circuit via the housing.
2. The device of claim 1 , wherein the first connector includes a resilient connector configured to, during use, hold the power source in a press fit against the insulating layer.
3. The device of claim 1 , wherein the second connector includes a resilient connector configured to maintain conductive coupling between the electronic circuit and the side of the housing.
4. The device of claim 1 , wherein the power source is a coin cell, one of the first electrical contact and the second electrical contact is a positive terminal, and the other of the first electrical contact and the second electrical contact is a negative terminal.
5. The device of claim 1 , wherein an area of contact between the second electrical contact and the insulating layer is in the range from about 15 mm 2 to about 500 mm 2 .
6. The device of claim 1 , wherein the entire surface area of the second electrical contact is in contact with the insulating layer.
7. The device of claim 1 , wherein the side of the housing includes a raised portion positioned to protrude through the insulating layer and contact the second electrical contact.
8. The device of claim 1 , wherein the second connector includes a plurality of second connectors.
9. The device of claim 1 , wherein the insulating layer includes an anodized layer of the conductive material.
10. The device of claim 1 , wherein the second connector is conductively coupled to the electronic circuit via a surface mounted technology (SMT) connector.
11. The device of claim 1 , wherein the electronic circuit is configured to receive fitness data from one or more sensors, the fitness data associated with a user of the device.
12. The device of claim 1 , wherein the second connector is configured to ground the housing.
13. A method, comprising:
disposing an electronic circuit in a housing, the housing constructed from a conductive material, the electronic circuit electrically insulated from the housing;
disposing a power source between the electronic circuit and a side of the housing, the power source positioned such that a first electrical contact of the power source faces the electronic circuit, and such that a second electrical contact of the power source faces the side of the housing;
electrically coupling the electronic circuit and the first electrical contact via a first connector;
electrically coupling, via a second connector, the electronic circuit and a side of the housing via a first aperture of an insulating layer on the side of the housing, the insulating layer including the first aperture and a second aperture formed therein; and
electrically coupling the second electrical contact with the side of the housing via the second aperture of the insulating layer, such that the second electrical contact is conductively coupled to the electronic circuit via the housing and the second connector for complete electrical interconnection between the power source and the electronic circuit via the housing,
wherein the entire surface area of the second electrical contact is in contact with the insulating layer.
14. The method of claim 13 , wherein the first electrical contact includes a resilient connector, the placing the power source further including positioning the power source between the resilient connector and the insulating layer, such that the power source in a press fit against the insulating layer.
15. The method of claim 13 , wherein one of the first electrical contact and the second electrical contact is a positive terminal and the other of the first electrical contact and the second electrical contact is a negative terminal, the placing the power source further including positioning the power source such that the positive terminal faces the electronic circuit.
16. The method of claim 13 , wherein one of the first electrical contact and the second electrical contact is a positive terminal and the other of the first electrical contact and the second electrical contact is a negative terminal, the placing the power source further including positioning the power source such that the negative terminal faces the electronic circuit.
17. The method of claim 13 , wherein the insulating layer is an anodized layer.
18. The method of claim 13 , further comprising:
electrically coupling, via a surface mounted technology (SMT) connector, the second connector to the electronic circuit.