Heat sink assemblies for surface mounted devices
According to some aspects of the present disclosure, heat sink assemblies are disclosed. Example heat sink assemblies include a printed circuit board having a first side and a second side. The printed circuit board defines an opening extending from the first side to the second side. The heat sink assembly also includes a heat sink coupled to the first side of the printed circuit board. The heat sink includes a protrusion extending through the through opening of the printed circuit board. The heat sink assembly further includes a surface mounted device coupled to the second side of the printed circuit board. The surface mounted device is in thermal contact with the protrusion of the heat sink to transfer heat from the surface mounted device to the heat sink. Example methods of manufacturing heat sink assemblies are also disclosed.
1. A heat sink assembly comprising:
a printed circuit board having a first side and a second side opposite the first side, the printed circuit board defining an opening extending from the first side of the printed circuit board to the second side of the printed circuit board;
a heat sink coupled to the first side of the printed circuit board with glue, the heat sink including a protrusion including a top surface having a surface area, the protrusion of the heat sink extending through the opening defined in the printed circuit board with the top surface of the protrusion substantially coplanar with the second side of the printed circuit board, the protrusion having a height that is greater than a thickness of the printed circuit board; and
a surface mount device coupled to the protrusion of the heat sink via solder, the surface mount device in thermal contact with the protrusion of the heat sink to transfer heat from the surface mount device to the heat sink, the surface mount device including a main body and at least one terminal extending from the main body, wherein the main body of the surface mount device and the top surface of the protrusion each have a length and a width, the length of the main body of the surface mount device is greater than the length of the top surface of the protrusion, and the width of the main body of the surface mount device is less than the width of the top surface of the protrusion.
2. The heat sink assembly of claim 1 , wherein the opening defined in the printed circuit board is plated with a thermally conductive material.
3. The heat sink assembly of claim 1 , wherein the glue includes a plurality of glue portions.
4. The heat sink assembly of claim 1 , wherein the heat sink comprises copper.
5. The heat sink assembly of claim 1 , wherein the heat sink comprises aluminum.
6. The heat sink assembly of claim 1 , wherein the heat sink is a first heat sink, the opening is a first opening, the surface mount device is a first surface mount device, and the printed circuit board further defines a second opening extending from the first side of the printed circuit board to the second side of the printed circuit board, the heat sink assembly further comprising:
a second heat sink coupled to the first side of the printed circuit board with the glue, the second heat sink including a second protrusion including a second top surface having a second surface area, the second protrusion of the second heat sink extending through the second opening with the second top surface of the second protrusion of the second heat sink substantially coplanar with the second side of the printed circuit board; and
a second surface mount device coupled to the second protrusion of the second heat sink via the solder, the second surface mount device in thermal contact with the second protrusion of the second heat sink to transfer heat from the second surface mount device to the second heat sink, the second surface mount device including a second main body and at least one second terminal extending from the second main body, wherein the second main body of the second surface mount device and the second top surface of the second protrusion of the second heat sink each have a second length and a second width, the second length of second main body of the second surface mount device is greater than the second length of the second top surface of the second protrusion of the second heat sink, and the second width of the second main body of the second surface mount device is less than the second width of the second top surface of the second protrusion of the second heat sink.
7. The heat sink assembly of claim 1 , further comprising a circuit disposed on the second side of the printed circuit board, wherein the surface mount device includes the at least one terminal electrically coupled to the circuit.
8. The heat sink assembly of claim 1 , wherein the heat sink includes multiple fins extending away from the first side of the printed circuit board.
9. A method of manufacturing a heat sink assembly, the method comprising:
coupling a heat sink having a protrusion to a first side of a printed circuit board with glue, the printed circuit board having an opening, the protrusion positioned in the opening, the opening defined between the first side of the printed circuit board and a second side of the printed circuit board opposite the first side, the protrusion having a height that is greater than a thickness of the printed circuit board with a top surface of the protrusion substantially coplanar with the second side of the printed circuit board, and the top surface of the protrusion having a surface area; and
coupling a surface mount device to the protrusion of the heat sink via solder, to transfer heat from the surface mount device to the heat sink, the surface mount device including a main body and at least one terminal extending from the main body, wherein the main body of the surface mount device and the top surface of the protrusion each have a length and a width, the length of the main body of the surface mount device is greater than the length of the top surface of the protrusion, and the width of the main body of the surface mount device is less than the width of the top surface of the protrusion.
10. The method of claim 9 , wherein the glue includes one or more glue dots, and the coupling of the heat sink to the first side of the printed circuit board includes applying the one or more glue dots to the first side of the printed circuit board adjacent the opening and contacting the heat sink to the one or more glue dots.
11. The method of claim 10 , wherein the coupling of the heat sink includes placing the second side of the printed circuit board against a flat surface, and inserting the heat sink through the opening defined in the printed circuit board until the protrusion of the heat sink contacts the flat surface to align that the protrusion of the heat sink coplanar with the second side of the printed circuit board.
12. The method of claim 11 , further comprising heat curing the printed circuit board and the heat sink to set the one or more glue dots and secure the heat sink to the printed circuit board.
13. The method of claim 8 , wherein the coupling of the surface mount device to the protrusion of the heat sink includes applying the solder to the protrusion of the heat sink, and contacting the surface mount device to the solder.