IP Library Granted Patent US 9,912,339
Granted Patent B2
US 9,912,339 · App. 15/283,742 · Granted Mar 6, 2018

Atomic oscillator

Inventor: Koji Chindo (Suwa, JP)
Assignee: Seiko Epson Corporation
H03L7/26G04F5/14H01S1/00H01S1/06H03B17/00
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Quick Facts
Patent No.
US 9,912,339
App. No.
15/283,742
Granted
Mar 6, 2018
Kind
B2
Abstract

An atomic oscillator includes a gas cell that has metal atoms sealed therein, a heating unit that heats the gas cell, a heat transmission unit that is positioned between the gas cell and the heating unit, is thermally connected to the gas cell, and transmits heat generated by the heating unit to the gas cell, and a light absorbing unit that is thermally connected to the gas cell so as to be separated from the heat transmission unit and absorbs heat of the gas cell. The heat transmission unit includes a gas cell accommodation portion including at least a pair of gas cell accommodation walls disposed outside the gas cell, and a thermal conductive elastic member which is interposed in a gap formed by the gas cell and the gas cell accommodation walls of the heat transmission unit.

Claims (17)

1. An atomic oscillator comprising:

a gas cell that is configured with first and second window members and a wall so that the gas cell has an inner space enclosed by the first and second window members and the wall, metal atoms being sealed in the inner space, the wall having first, second, third, and forth side frames, the third and fourth frames being connected between the first and second frames;

a heater configured to heat the gas cell, the heater being provided at a side directly adjacent to the first side frame of the gas cell;

a heat transmission member that is coupled to the first, third, and forth side frames and the first and second window members so as to thermally connect the heater to the gas cell and to transmit heat generated by the heater to the gas cell;

a heat absorbing member that is coupled to the second, third, and fourth frames and the first and second window members so as to be thermally connected to the gas cell and to absorb heat of the gas cell and dissipate the heat to an outside of the gas cell;

a first thermal conductive elastic member configured to transfer heat, the first thermal conductive elastic member being provided between the heat transmission member and a first outer surface of the gas cell so that the first thermal conductive elastic member is sandwiched therebetween, the first outer surface is configured with the first, third, and forth side frames and the first and second window members; and

a second thermal conductive elastic member configured to transfer heat, the second thermal conductive elastic member being provided between the heat absorbing member and a second outer surface of the gas cell so that the second thermal conductive elastic member is sandwiched therebetween, the second outer surface is configured with the second, third, and forth side frames and the first and second window members,

wherein the heat generated by the heater transmits to the heat absorbing member via the heat transmission member, the first thermal conductive elastic member, the gas cell, and the second thermal conductive elastic member.

2. The atomic oscillator according to claim 1 ,

wherein each of the first and second thermal conductive elastic members is a rubber-based adhesive, a packing, or a sheet piece.

3. The atomic oscillator according to claim 1 ,

wherein each of the first and second thermal conductive elastic members is a rubber-based filler.

4. The atomic oscillator according to claim 1 , further comprising:

a coil that generates a magnetic field passing through the gas cell; and

a magnetic shield that accommodates the gas cell, the heat transmission member, the heat absorbing member, and the coil therein,

wherein the heat transmission member and the heat absorbing member are thermally connected to the magnetic shield, and

wherein the heater is thermally connected to an outer side of the magnetic shield.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2022
From: SEIKO EPSON CORPORATION
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 061301/0770 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2016
From: CHINDO, KOJI
To: SEIKO EPSON CORPORATION
Reel/Frame 039922/0599 →
Priority Claims (1)
JP 2015-198261 · Oct 6, 2015 · national
Continuity (1)
Related Publication 20170099060A1 · Apr 6, 2017