Direct coupled driver for mach-zehnder optical modulators
View Patent ↗An optical modulator device directly-coupled to a driver circuit device. The optical modulator device can include a transmission line electrically coupled to an internal VDD, a first electrode electrically coupled to the transmission line, a second electrode electrically coupled to the first electrode and the transmission line. A wave guide can be operably coupled to the first and second electrodes, and a driver circuit device can be directly coupled to the transmission line and the first and second electrodes. This optical modulator and the driver circuit device can be configured without back termination.
1. An apparatus comprising:
a driver circuit on a first chip including a driver power supply voltage (VDD);
an optical modulator on a second chip including,
a transmission line electrically coupled to the VDD,
a first electrode electrically coupled to the transmission line,
a second electrode electrically coupled to the first electrode and the transmission line,
a wave guide operably coupled to the first and second electrodes; and
an interface directly coupling the driver circuit and the transmission line, wherein the optical modulator and the driver circuit are configured without back termination.
2. The apparatus of claim 1 wherein the interface comprises a flip-chip application.
3. The apparatus of claim 1 wherein the interface comprises a bond wire.
4. The apparatus of claim 1 wherein the driver circuit comprises a driver op-amp circuit electrically coupled the transmission line, and a bias loop circuit electrically coupled to the first and second electrodes and the driver op-amp circuit.
5. The apparatus of claim 4 wherein the bias loop circuit comprises a buffer op-amp, a voltage source, and a high impedance node, wherein the buffer op-amp is electrically coupled to the voltage source and the high impedance node, the high impedance node being electrically coupled to the driver op-amp circuit and the transmission line, the voltage source being electrically coupled to the first and second electrodes.
6. The apparatus of claim 1 wherein the optical modulator comprises a load resistor as an input point for the VDD.
7. The apparatus of claim 1 wherein the optical modulator device comprises a Mach-Zehnder Modulator (MZM).
8. The apparatus of claim 1 wherein the first and second electrodes comprise reverse-biased diodes.
9. The apparatus of claim 1 wherein the transmission line and the first and second electrodes are configured as a microstrip line, a coplanar waveguide (CPW), or a parallel plate transmission line.
10. An apparatus comprising a first chip including an optical modulator device directly-coupled through an interface to a second chip including a driver circuit device, the driver circuit device comprising:
a driver op-amp circuit directly-coupled to the optical modulator device; and
a bias control loop circuit coupled to the driver op-amp circuit and the optical modulator device, the bias control loop circuit including a buffer op-amp, a voltage source, and a high impedance node, wherein the optical modulator device and the driver circuit device are configured without back termination.
11. The apparatus of claim 10 wherein the interface comprises a flip-chip application.
12. The apparatus of claim 10 wherein the interface comprises a bond wire.
13. The apparatus of claim 10 wherein the buffer op-amp is electrically coupled to the voltage source and the high impedance node, the high impedance node being electrically coupled to the driver op-amp circuit and the optical modulator, the voltage source being electrically coupled to the optical modulator.
14. The apparatus of claim 10 wherein the optical modulator device comprises a differential modulator device.
15. The apparatus of claim 10 wherein the optical modular device comprises a single ended modulator device.
16. The apparatus of claim 10 wherein the optical modulator device comprises a Mach-Zehnder modulator (MZM) device.
17. The apparatus of claim 10 wherein the optical modulator device comprises a pair of modulator electrodes, and wherein the bias control loop circuit is configured to provide a bias voltage to the modulator electrodes.
18. An optical network system comprising:
a receiver device configured to receive four communication channels, each of the channels being capable of transferring incoming data at 25 GPS;
a clock data recovery circuit configured to receive the incoming data from the four communication channels;
an encoder to format the incoming data from the four channel communications;
an optical modulator device on a first chip and comprising a transmission line electrically coupled to a driver power supply voltage (VDD), a first electrode electrically coupled to the transmission line, a second electrode electrically coupled to the first electrode and the transmission line, and a wave guide operably coupled to the first and second electrodes; and
a driver circuit device on a second chip and directly coupled through an interface to the transmission line and the first and second electrodes, the driver device being configured to drive the encoded incoming data, wherein the optical modulator device and the driver circuit device are configured without back termination.
19. The optical network system of claim 18 wherein the interface comprises a bond wire or a flip-chip application.
20. The optical network system of claim 18 wherein the driver circuit comprises a driver op-amp circuit electrically coupled to the transmission line, and a bias loop circuit electrically coupled to the first and second electrodes and the driver op-amp circuit.