Systems and methods for separation of thermal interface bond

1. A method comprising:

receiving a user interaction at a mechanical mechanism that includes an interface bracket configured to mechanically couple a first component and a second component, the interface bracket including a body and a lever coupled to the body, the lever including an effort arm and a load arm, wherein the user interaction includes application of a force to the effort arm; and

in response to the user interaction, separating a mechanical bond between the first component and the second component by applying a controlled force of the mechanical mechanism to the first component at a controlled location of the first component, wherein the controlled force is applied by the load arm.

2. The method of claim 1 , wherein the mechanical bond comprises an adhesive bond between the first component and the second component.

3. The method of claim 1 , wherein the mechanical bond comprises a bond of thermal interface material between the first component and the second component.

4. The method of claim 1 , wherein the second component comprises a heat dissipater.

5. The method of claim 1 , wherein the first component comprises a processor.

6. A system comprising:

an interface bracket configured to mechanically couple a first component and a second component, the interface bracket including a body and a lever coupled to the body;

wherein the lever includes an effort arm and a load arm, and wherein the lever is configured to:

receive a user interaction, wherein the user interaction includes application of a force to the effort arm; and

in response to the user interaction, separate a mechanical bond between the first component and the second component by applying a controlled force to the first component at a controlled location of the first component, wherein the controlled force is applied by the load arm.

7. The system of claim 6 , wherein the mechanical bond comprises an adhesive bond between the first component and the second component.

8. The system of claim 6 , wherein the mechanical bond comprises a bond of thermal interface material between the first component and the second component.

9. The system of claim 6 , wherein the second component comprises a heat dissipater.

10. The system of claim 6 , wherein the first component comprises a processor.

11. An information handling system comprising:

a circuit board;

an information handling resource electrically coupled to the circuit board; and

a loading system for providing loading to electrically couple the information handling resource to the circuit board, the loading system including an interface bracket configured to mechanically couple the information handling resource and a component, the interface bracket comprising a body and a lever mechanically coupled to the body, the lever including an effort arm and a load arm;

wherein the interface bracket is configured to:

receive a user interaction including application of a force to the effort arm; and

in response to the user interaction, separate a mechanical bond between the information handling resource and the component by the load arm applying a controlled force to the information handling resource at a controlled location of the information handling resource.

12. The information handling system of claim 11 , wherein the mechanical bond comprises an adhesive bond between the information handling resource and the component.

13. The information handling system of claim 11 , wherein the mechanical bond comprises a bond of thermal interface material between the information handling resource and the component.

14. The information handling system of claim 11 , wherein the component comprises a heat dissipater.