Method of manufacturing coil device
A method of manufacturing a coil device and the coil device includes a base layer and a coil pattern formed on a surface of the base layer. The method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.
1. A method of manufacturing a coil device, comprising:
forming a seed layer of a coil by bonding a conductive material to one surface of a base layer;
forming a seed layer of a coil by removing a portion of the conductive material to form a coil pattern through etching; and
forming a plating layer of the coil on the seed layer of the coil through plating,
wherein the forming the plating layer of the coil comprises,
electrically connecting both ends of the seed layer of the coil to each other,
applying a voltage through the both ends of the seed layer of the coil so that the seed layer has a predetermined electrical potential, and
separating the both ends of the seed layer of the coil.
2. The method of claim 1 , wherein the forming of the seed layer of the coil comprises:
coating a curable layer on the conductive material;
removing a portion of the curable layer through exposure and developing;
etching to remove a portion of the conductive material from which the curable layer is removed; and
stripping the remaining curable layer.
3. The method of claim 2 , wherein the removing of the portion of the curable layer through the exposure and the developing comprises:
changing a portion of the curable layer exposed to light into a photocured polymer and leaving a portion of the curable layer as an uncured monomer; and
removing the uncured monomer portion of the curable layer, in response to immersing the conductive material in a developing solution.
4. The method of claim 2 , wherein the curable layer is a dry film.
5. The method of claim 1 , wherein the seed layer comprises only the conductive material, and the plating layer is formed only through the plating process.
6. The method of claim 1 , wherein the base layer is formed of a material having relatively low conductivity and the seed layer is formed of a material having relatively high conductivity.
7. The method of claim 1 , wherein the conductive material is bonded to the base layer through a hot press process.
8. The method of claim 1 , wherein the conductive material is a copper foil.
9. The method of claim 1 , wherein the coil comprises a first coil and a second coil, which form the seed layer such that a first end of a first seed layer of the first coil, a second end of the first seed layer of the first coil, a first end of a second seed layer of the second coil, and a second end of the second seed layer of the second coil are electrically connected to each other.
10. The method of claim 9 , further comprising:
separating the first end of the first seed layer of the first coil, the second end of the first seed layer of the first coil, the first end of the second seed layer of the second coil, and the second end of the second seed layer of the second coil from each other.