IP Library Granted Patent US 10,059,849
Granted Patent B2
US 10,059,849 · App. 15/288,398 · Granted Aug 28, 2018

Methods of bonding using evaporation operative materials having low environmental impact

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Quick Facts
Patent No.
US 10,059,849
App. No.
15/288,398
Granted
Aug 28, 2018
Kind
B2
Abstract

A method of bonding two surfaces by delivering to at least one of the surfaces an adhesive composition comprising: (a) at least one active bonding component; and (b) a carrier in an amount effective to at least partially solvate or at least partially emulsify said active bonding component, said carrier comprising monochlorotrifluoropropene, and then forming a bond between the surfaces.

Claims (32)

1. A method of bonding two surfaces comprising:

(a) providing at least a first surface and a second surface;

(b) delivering an adhesive composition to at least one of said surfaces, said adhesive composition comprising:

(ii) an active bonding component; and

(b) a carrier solvating and/or emulsifying said active bonding compound, said carrier comprising at least monochlorotrifluoropropene;

(c) forming a bond between said first and second surfaces by step(s) comprising evaporating at least a portion of said carrier.

2. The method of claim 1 wherein said monochlorotrifluoropropene comprises 1-chloro-3,3,3-trifluoropropene (HCFO-1233zd).

3. The method of claim 2 wherein said 1-chloro-3,3,3-trifluoropropene consists essentially of trans-1-chloro-3,3,3-trifluoropropene (trans-HCFO-1233zd).

4. The method of claim 3 wherein said carrier further comprises a co-carrier in addition to said 1-chloro-3,3,3-trifluoropropene.

5. The method of claim 2 wherein said 1-chloro-3,3,3-trifluoropropene comprises cis-1-chloro-3,3,3-trifluoropropene (cis-HCFO-1233zd).

6. A method for bonding or sealing to a surface comprising:

providing a composition comprising at least one active component comprising a bonding agent and/or a sealing agent; and a carrier solvating and/or emulsifying said bonding agent and/or said sealing agent, said carrier comprising 1-chloro-3,3,3-trifluoropropene;

applying the composition to the surface of a substrate; and

sealing and/or bonding by step(s) comprising removing the carrier from the active component.

7. The method of claim 6 wherein the carrier is removed by evaporation.

8. The method of claim 6 wherein said 1-chloro-3,3,3-trifluoropropene comprises cis-1-chloro-3,3,3-trifluoropropene (cis-HCFO-1233zd).

9. The method of claim 6 wherein said 1-chloro-3,3,3-trifluoropropene consists of cis-1-chloro-3,3,3-trifluoropropene (cis-HCFO-1233zd).

10. The method of claim 8 , wherein said applying step is selected from the group consisting of dipping, pouring, brushing, and immersing.

11. The composition of claim 1 wherein said carrier has a KB value of greater than 30.

12. A method for applying a bonding agent or a sealing agent to a surface comprising:

providing a composition comprising:

(a) a bonding agent and/or a sealing agent; and

(b) a carrier solvating and/or emulsifying at least a portion of said bonding agent and/or said sealing agent, said carrier comprising at least monochlorotrifluoropropene;

applying the composition to the surface of a substrate; and

removing the carrier from said bonding agent and/or said sealing agent.

13. The method of claim 12 wherein the carrier is removed by evaporation.

14. The method of claim 12 wherein the composition is applied to the substrate by a spray-on application.

15. The method of claim 12 wherein said monochlorotrifluoropropene comprises cis-1-chloro-3,3,3-trifluoropropene (cis-HCFO-1233zd).

16. The method of claim 12 wherein said monochlorotrifluoropropene consists essentially of cis-1-chloro-3,3,3-trifluoropropene (cis-HCFO-1233zd).

17. The method of claim 15 , wherein said applying step is selected from the group consisting of dipping, pouring, brushing, and immersing.

18. The method of claim 2 wherein said 1-chloro-3,3,3-trifluoropropene consists of cis-1-chloro-3,3,3-trifluoropropene (cis-HCFO-1233zd).

19. The method of claim 1 wherein said carrier consists essentially of said cis-HCFO-1233zd.

Assignments (2)
SECURITY INTEREST Recorded Jan 12, 2026
From: SOLSTICE ADVANCED MATERIALS US, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 074569/0260 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2016
From: HULSE, RYAN; MERCIER, DIANA; COOK, KANE; BASU, RAJAT S.; PAONESSA, MARTIN R.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 039993/0906 →