Coil device of wireless power transfer system
There are provided a coil device, a method for manufacturing the coil, and a wireless power transfer system-charger or a wireless power transfer system-device, which includes the coil device. A coil device includes: a substrate including first and second terminals; and a first coil disposed on one surface of the substrate, the first coil being disposed while turning at least once, wherein the first coil includes a plurality of wires self-bonded to be stacked on the substrate, wherein one sides of the plurality of wires are commonly connected to the first terminal, and the other sides of the plurality of wires are commonly connected to the second terminal.
1. A coil device comprising:
a substrate, wherein the substrate is a magnetic sheet; and
a coil disposed on one surface of the substrate and including a plurality of layers, each layer being stacked in a vertical direction and including a plurality of wires,
wherein each wire is wound in a horizontal direction and a vertical direction to form the plurality of layers,
wherein each wire within a respective layer is positioned in a same vertical line along the vertical direction,
wherein a height of the plurality of wires positioned in the same vertical line is greater than a width of each wire positioned in the same vertical line,
wherein each layer is provided directly on a surface of the substrate,
wherein the wires of each layer are aligned to the wires of an adjacent layer in the horizontal direction,
wherein each wire is only self-bonded in the vertical direction to an adjacent wire within the respective layer, and
wherein each layer has a flat first surface and a flat second surface opposite to the flat first surface, the plurality of layers comprises a first layer, and a second layer on the first layer, and the flat first surface of the second layer contacts the flat second surface of the first layer.
2. The coil device according to claim 1 , further comprising first and second terminals connected to each wire.
3. The coil device according to claim 1 , wherein each wire is a solid wire.
4. The coil device according to claim 1 , wherein the coil is a flat type copper wire.
5. The coil device according to claim 1 , wherein each wire is a litz wire.
6. The coil device according to claim 1 , wherein the coil is an induction coil or a resonance coil.
7. A coil device comprising:
a substrate comprising first and second terminals, wherein the substrate is a magnetic sheet; and
a first coil disposed on one surface of the substrate and including a plurality of layers, each layer being stacked in a vertical direction and including a plurality of wires,
wherein each wire is wound in a horizontal direction and a vertical direction to form the plurality of layers,
wherein each wire within a respective layer is positioned in a same vertical line along the vertical direction,
wherein each wire is only self-bonded in the vertical direction to an adjacent wire within the respective layer and is stacked on the substrate,
wherein a height of the plurality of wires positioned in the same vertical line is greater than a width of each wire positioned in the same vertical line,
wherein one sides of the plurality of wires are commonly connected to the first terminal, and the other sides of the plurality of wires are commonly connected to the second terminal,
wherein each layer is provided directly on a surface of the substrate,
wherein the wires of each layer are aligned to the wires of an adjacent layer in the horizontal direction, and
wherein each layer has a flat first surface and a flat second surface opposite to the flat first surface, the plurality of layers comprises a first layer, and a second layer on the first layer, and the flat first surface of the second layer contacts the flat second surface of the first layer.
8. The coil device according to claim 7 , wherein each wire is a solid wire.
9. The coil device according to claim 7 , wherein each wire is a Litz wire.
10. The coil device according to claim 7 , wherein each wire is a flat type copper wire.
11. The coil device according to claim 7 , wherein the first coil is an induction coil.
12. The coil device according to claim 11 , further comprising a second coil comprising a plurality of self-bonded wires stacked on the substrate,
wherein the second coil is a resonance coil.