IP Library Granted Patent US 10,869,651
Granted Patent B2
US 10,869,651 · App. 15/292,557 · Granted Dec 22, 2020

Ultrasonic probe and ultrasonic diagnosis apparatus

Inventors: Kengo Okada (Kawasaki, JP); Hiroyuki Shikata (Nasushiobara, JP); Takahiro Sogou (Yokohama, JP)
Assignee: Canon Medical Systems Corporation
A61B8/445A61B1/00006A61B1/0055A61B1/0057A61B8/12A61B8/56
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Quick Facts
Patent No.
US 10,869,651
App. No.
15/292,557
Granted
Dec 22, 2020
Kind
B2
Abstract

An ultrasonic probe according to an embodiment includes a tip part, an operation part, a bending part, and a heat conducting part. The tip part includes transducer elements configured to transmit and receive ultrasound waves, electronic circuitry electrically connected to the transducer elements, and a frame having the electronic circuitry provided thereon. The operation part receives operations from an operator. The bending part includes a cable electrically connected to the electronic circuitry, and changes the orientation of the tip part by bending in accordance with operations performed on the operation part. The heat conducting part includes a unitary component extending from the tip part at least to the bending part, and is in contact with the frame in the tip part and in the close vicinity of the cable in the bending part.

Claims (41)

1. An ultrasonic probe comprising:

a tip part including transducer elements configured to transmit and receive ultrasound waves, electronic circuitry electrically connected to the transducer elements, and a frame having the electronic circuitry provided thereon;

an operation part configured to receive operations from an operator;

a bending part including a cable electrically connected to the electronic circuitry, the bending part being configured to change an orientation of the tip part by bending in accordance with operations performed on the operation part; and

a heat conducting part including a unitary component extending from the tip part to a position which is located on an opposite side to the tip part side of the bending part with respect to an end of the tip part side of the bending part, the heat conducting part being in contact with the frame in the tip part and in the close vicinity of the cable in the bending part.

2. The ultrasonic probe according to claim 1 , wherein the heat conducting part is wrapped around the cable in the bending part.

3. The ultrasonic probe according to claim 2 , wherein the heat conducting part is spirally wrapped around the cable in the bending part.

4. The ultrasonic probe according to claim 1 , wherein the tip part includes flexible printed circuits (FPC) serving as an intermediate for electronic connection between the electronic circuitry and the cable and provided in such a manner that the FPC do not impede thermal contact between the frame and the heat conducting part.

5. The ultrasonic probe according to claim 1 , wherein

the transducer elements are located on a front surface side of the frame, and

the heat conducting part is in contact with a back surface side of the frame in the tip part.

6. The ultrasonic probe according to claim 5 , wherein

the electronic circuitry is located on the front surface side of the frame, and

the tip part includes a flexible printed circuit (FPC) serving as an intermediate for electronic connection between the electronic circuitry and the cable and passing along the back surface side of the frame.

7. The ultrasonic probe according to claim 1 , wherein the heat conducting part is constructed of at least one thermally conductive sheet.

8. The ultrasonic probe according to claim 7 , wherein the thermally conductive sheet has thermal conductivity of at least 1 W/m·k in a thickness direction thereof and has thermal conductivity of at least 300 W/m·k in a direction along a plane perpendicular to the thickness direction.

9. The ultrasonic probe according to claim 1 , wherein the electronic circuitry includes at least one of drive signal generating circuitry, delay circuitry, adder circuitry, and transmission/reception channel controlling circuitry.

10. The ultrasonic probe according to claim 1 , wherein

the bending part includes angle rings configured to deform in accordance with operations on the operation part, and

the heat conducting part is located to the inner side of the angle rings in the bending part.

11. The ultrasonic probe according to claim 1 , wherein

the unitary component is a sheet-like heat conducting component, and

the heat conducting part includes the heat conducting component in a folded state.

12. The ultrasonic probe according to claim 1 , wherein the unitary component is constructed of a component that contains carbon graphite.

13. An ultrasonic diagnosis apparatus comprising image generation circuitry configured to generate an ultrasonic image based on output from an ultrasonic probe comprising:

a tip part including transducer elements configured to transmit and receive ultrasound waves, electronic circuitry electrically connected to the transducer elements, and a frame having the electronic circuitry provided thereon;

an operation part configured to receive operations from an operator;

a bending part including a cable electrically connected to the electronic circuitry, the bending part being configured to change an orientation of the tip part by bending in accordance with operations performed on the operation part; and

a heat conducting part including a unitary component extending from the tip part to a position which is located on an opposite side to the tip part side of the bending part with respect to an end of the tip part side of the bending part, the heat conducting part being in contact with the frame in the tip part and in the close vicinity of the cable in the bending part.

14. The ultrasonic diagnosis apparatus according to claim 13 , wherein the heat conducting part is wrapped around the cable in the bending part.

15. The ultrasonic diagnosis apparatus according to claim 14 , wherein the heat conducting part is spirally wrapped around the cable in the bending part.

16. The ultrasonic diagnosis apparatus according to claim 13 , wherein the tip part includes flexible printed circuits (FPC) serving as an intermediate for electronic connection between the electronic circuitry and the cable and provided in such a manner that the FPC do not impede thermal contact between the frame and the heat conducting part.

17. The ultrasonic diagnosis apparatus according to claim 13 , wherein

the transducer elements are located on a front surface side of the frame, and

the heat conducting part is in contact with a back surface side of the frame in the tip part.

18. The ultrasonic diagnosis apparatus according to claim 13 , wherein

the bending part includes angle rings configured to deform in accordance with operations on the operation part, and

the heat conducting part is located to the inner side of the angle rings in the bending part.

19. The ultrasonic diagnosis apparatus according to claim 13 , wherein

the unitary component is a sheet-like heat conducting component, and

the heat conducting part includes the heat conducting component in a folded state.

Assignments (2)
CHANGE OF NAME Recorded Jul 26, 2019
From: TOSHIBA MEDICAL SYSTEMS CORPORATION
To: CANON MEDICAL SYSTEMS CORPORATION
Reel/Frame 049879/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2017
From: OKADA, KENGO; SHIKATA, HIROYUKI; SOGOU, TAKAHIRO
To: TOSHIBA MEDICAL SYSTEMS CORPORATION
Reel/Frame 041260/0105 →
Priority Claims (2)
JP 2015-202387 · Oct 13, 2015 · national
JP 2016-201257 · Oct 12, 2016 · national
Continuity (1)
Related Publication 20170100095A1 · Apr 13, 2017