Sound damping wallboard and method of forming a sound damping wallboard
View Patent ↗A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard includes a gypsum layer having a first side with a first gypsum surface, a first encasing layer at least partially covering the first gypsum surface to form a first encasing layer portion, and a sound damping layer on the first side covering at least part of the first encasing layer portion.
1. A sound damping wallboard, comprising:
a gypsum layer having a first side with a first gypsum surface;
a first encasing layer at least partially covering the first gypsum surface to form a first encasing layer portion;
a sound damping layer on the first side covering at least part of the first encasing layer portion, the sound damping layer having a sound damping layer surface opposite the gypsum layer; and
an outer encasing layer on the sound damping layer surface.
2. The sound damping wallboard of claim 1 , wherein the first encasing layer completely covers the first gypsum surface to form the first encasing layer portion.
3. The sound damping wallboard of claim 1 , wherein the first encasing layer has a weight of between about 30 and about 60 pounds per thousand square feet of surface area.
4. The sound damping wallboard of claim 1 , wherein the gypsum layer has a thickness of between about 0.25 inches and about 0.375 inches.
5. The sound damping wallboard of claim 1 , wherein the gypsum layer has a density of at least 1200 pounds per thousand square feet.
6. The sound damping wallboard of claim 1 , wherein the sound damping layer comprises a viscoelastic polymer.
7. A method of forming a sound damping wallboard, comprising the steps of:
providing a first gypsum layer having a first side with a first gypsum surface, and a first encasing layer covering the first gypsum surface; and
removing at least part of the first encasing layer to expose the first gypsum surface, form a first gypsum surface portion on the first side, and allow application of a sound damping layer to the first side to cover at least part of the first gypsum surface portion.
8. The method of claim 7 , wherein removing at least part of the first encasing layer includes removing by abrasion.
9. The method of claim 8 , wherein removing by abrasion includes removing by a moving surface.
10. The method of claim 9 , further comprising transporting the first gypsum layer and the first encasing layer to the moving surface.
11. The method of claim 10 , wherein the moving surface includes an abrasive material.
12. The method of claim 7 , wherein removing at least part of the first encasing layer includes removing by planing.
13. The method of claim 12 , wherein removing by planing includes removing by at least one blade.
14. The method of claim 13 , further comprising transporting the first gypsum layer and the first encasing layer to the at least one blade.
15. The method of claim 7 , wherein removing at least part of the first encasing layer includes removing by peeling.
16. The method of claim 15 , wherein removing by peeling includes removing with a pulling member.
17. The method of claim 16 , further comprising transporting the first gypsum layer and the first encasing layer to the pulling member.
18. A sound damping wallboard, comprising:
a gypsum layer having a first side with a first gypsum surface and a second side with a second gypsum surface;
a first encasing layer at least partially covering the first gypsum surface;
a second encasing layer at least partially covering the second gypsum surface opposite the first gypsum surface;
a sound damping layer at the first side of the gypsum layer and at least partially covering the first encasing layer portion, the sound damping layer having a sound damping layer surface opposite the gypsum layer; and
an outer encasing layer on the sound damping layer surface.
19. The sound damping wallboard of claim 18 , wherein the first encasing layer completely cover the first gypsum surface and the second encasing layer completely covers the second gypsum surface.
20. The sound damping wallboard of claim 18 , wherein each of the first encasing layer and the second encasing layer has a weight of between about 30 and about 60 pounds per thousand square feet of surface area.
21. The sound damping wallboard of claim 18 , wherein the gypsum layer has a thickness of between about 0.25 inches and about 0.375 inches.
22. The sound damping wallboard of claim 18 , wherein the gypsum layer has a density of at least 1200 pounds per thousand square feet.