IP Library Granted Patent US 9,829,659
Granted Patent B2
US 9,829,659 · App. 15/295,241 · Granted Nov 28, 2017

Through transmission path on photonic circuits for optical alignment

Inventors: Long Chen (Marlboro, NJ); Christopher Doerr (Middleton, NJ); Diedrik Vermeulen (Somerville, MA)
Assignee: Acacia Communications, Inc.
G02B6/4225G02B6/122G02B6/12004G02B6/1228G02B6/2852G02B6/30G02B6/34G02B6/4227G02B2006/12109G02B2006/12126
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Quick Facts
Patent No.
US 9,829,659
App. No.
15/295,241
Granted
Nov 28, 2017
Kind
B2
Abstract

A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

Claims (28)

1. A photonic integrated circuit comprising:

first, second, and third optical waveguides, the first and third optical waveguides having ends terminating proximate a common edge of a substrate of the photonic integrated circuit, and the second optical waveguide comprising an optical impedance element;

a first tap coupler coupling the first optical waveguide to the second optical waveguide; and

a second tap coupler coupling the second optical waveguide to the third optical waveguide.

2. The photonic integrated circuit of claim 1 , wherein the optical impedance element comprises an optical filter.

3. The photonic integrated circuit of claim 2 , wherein the optical filter comprises a multimode optical filter.

4. The photonic integrated circuit of claim 2 , wherein the optical filter comprises a germanium absorption element.

5. The photonic integrated circuit of claim 4 , wherein the germanium absorption element comprises a layer comprising germanium.

6. The photonic integrated circuit of claim 5 , wherein the germanium layer comprises a silicon/germanium alloy.

7. The photonic integrated circuit of claim 1 , wherein the optical impedance element comprises a variable optical attenuator.

8. The photonic integrated circuit of claim 1 , wherein the ends of the first and third optical waveguides are tapered.

9. The photonic integrated circuit of claim 1 , wherein the ends of the first and third optical waveguides are coupled to respective optical gratings.

10. The photonic integrated circuit of claim 1 , wherein the ends of the first and third optical waveguides are coupled to respective photodetectors.

11. The photonic integrated circuit of claim 1 , comprising three or more optical waveguides having respective ends terminating proximate the common edge of the substrate, the three or more optical waveguides including the first optical waveguide and the third optical waveguide, wherein the first optical waveguide is an outermost optical waveguide of the three or more optical waveguides.

12. The photonic integrated circuit of claim 11 , wherein the third optical waveguide is an outermost optical waveguide of the three or more optical waveguides.

13. A method comprising:

optically coupling an alignment signal between a first optical component and a first optical waveguide, the first optical waveguide being disposed on a photonic integrated circuit and having a first end terminating proximate an edge of a substrate of the photonic integrated circuit;

optically coupling the alignment signal between the first optical waveguide and an optical impedance element;

optically coupling the alignment signal between the optical impedance element and a second optical waveguide, the second optical waveguide having a second end terminating proximate the edge of the substrate; and

optically coupling the alignment signal between the second optical waveguide and a second optical component.

14. The method of claim 13 , wherein the first optical component and the second optical component are disposed outside the photonic integrated circuit.

15. The method of claim 13 , further comprising adjusting a position of the photonic integrated circuit relative to the first optical component and the second optical component until an optical power of the alignment signal that is optically coupled to the second optical component reaches a threshold.

16. The method of claim 13 , wherein the alignment signal has a first optical wavelength and the first optical waveguide is configured to receive an optical signal having a second optical wavelength, and

wherein the first optical wavelength and the second optical wavelength are separated by an optical bandwidth greater than 10 nm.

17. The method of claim 16 , further comprising attenuating the optical signal with the optical impedance element.

18. The method of claim 13 , wherein optically coupling the alignment signal between the first optical component and the first optical waveguide is performed via edge-coupling.

19. The method of claim 13 , wherein optically coupling the alignment signal between the first optical component and the first optical waveguide is performed via surface-coupling.

20. The method of claim 13 , wherein optically coupling the alignment signal between the first optical waveguide and the optical impedance element is performed using a first tap coupler and optically coupling the alignment signal between the optical impedance element and the second optical waveguide is performed using a second tap coupler.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2024
From: ACACIA COMMUNICATIONS, INC.
To: ACACIA TECHNOLOGY, INC.
Reel/Frame 066832/0659 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2016
From: CHEN, LONG; DOERR, CHRISTOPHER; VERMEULEN, DIEDRIK
To: ACACIA COMMUNICATIONS, INC.
Reel/Frame 040043/0458 →
Continuity (3)
Continuation 14991816 · Jan 8, 2016
Provisional Application 62101049 · Jan 8, 2015
Related Publication 20170031113A1 · Feb 2, 2017