Hybrid thermal management of electronic device
An enclosure with hybrid thermal management for a heat-generating electronic device comprises a passive heat sink for conducting heat away from the electronic device, a cold skin adapted to slide over the top of the passive heat sink and having a front wall forming a plurality of air intake ports, and a plurality of blowers mounted inside the cold skin for drawing air into the cold skin though the air intake ports and then directing the air through the passive heat sink. In one implementation, the passive heat exchanger includes multiple thermally conductive fins adjacent to the electronic device and extending rearwardly from the intake ports, the fins being spaced apart from each other for conducting heat away from the electronic device. The blowers preferably direct air rearwardly from the intake ports in the front wall into the spaces between the thermally conductive fins.
1. An enclosure with hybrid thermal management for a heat-generating electronic device, said enclosure comprising
a passive heat sink for conducting heat away from said electronic device, wherein said passive heat sink has a removed section that forms a step,
a cold skin adapted to slide over the top of said passive heat sink and having a front wall forming a plurality of air intake ports, and
a plurality of blowers mounted inside said step of said passive heat sink for drawing air into said cold skin though said air intake ports and then directing said air through said passive heat sink.
2. The enclosure of claim 1 in which said passive heat sink includes multiple thermally conductive fins adjacent to said electronic device and extending rearwardly from said intake ports, said fins being spaced apart from each other for conducting heat away from said electronic device and wherein said step of said passive heat sink is a removed section of said multiple thermally conductive fins.
3. The enclosure of claim 2 in which said blowers direct air from said intake ports into said spaces between said thermally conductive fins.
4. The enclosure of claim 2 in which said thermally conductive fins extend vertically along said air intake ports and above said intake ports.
5. The enclosure of claim 2 in which said passive heat sink includes side walls forming a space below said fins for receiving said heat-generating electronic device.
6. The enclosure of claim 1 in which said heat-generating electronic device includes optical ports to transmit optical signals.
7. The enclosure of claim 1 which includes a controller coupled to said blowers for adjusting the speed of said blowers based on the temperature in said enclosure.
8. The enclosure of claim 1 in which said heat-generating electronic device comprises a transceiver.
9. The enclosure of claim 8 in which said transceiver is an SFP.
10. The enclosure of claim 1 wherein the cold skin is adapted to slide over the top of said passive heat sink to form a flat surface.
11. The enclosure of claim 1 , wherein the enclosure is rack mounted.