Resonance-coupled signaling between IC modules
Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative multi-module integrated circuit comprises: a transmitter in a first module, the transmitter providing a modulated carrier signal; a receiver in a second module demodulating the modulated carrier signal; and a galvanically isolated signaling path that includes: a first integrated resonator in the first module and a second integrated resonator in the second module, the first and second integrated resonators being resonantly coupled to convey the modulated carrier signal from the transmitter to the receiver. An illustrative embodiment of a method for providing an integrated circuit with a connection terminal for galvanically isolated signaling comprises: equipping the integrated circuit with a transmitter or receiver of a modulated carrier signal; connecting a transfer conductor to the connection terminal; and resonantly coupling the transmitter or receiver to a transfer conductor to convey the modulated carrier signal between the transfer conductor and the transmitter or receiver.
1. An integrated circuit configured for galvanically isolated signaling via a connection terminal, the integrated circuit comprising:
a transfer conductor connected to the connection terminal;
a transmitter or receiver of a modulated carrier signal; and
an integrated resonator resonant at a carrier signal frequency, the integrated resonator being laterally adjacent to, and electromagnetically coupled with, the transfer conductor to convey the modulated carrier signal between the transfer conductor and the transmitter or receiver,
wherein said connection terminal is a first connection terminal connected to a second connection terminal by the transfer conductor, the first and second connection terminals being configured for electrically connecting to a remote pair of connection terminals which in turn are electrically connected to form a floating transfer loop,
wherein the transmitter or receiver comprises a transmitter configured to receive a digital signal and to produce pulses in the modulated carrier signal with a first pulse width for rising edges in the digital signal and a second different pulse width for falling edges in the digital signal.
2. The integrated circuit of claim 1 , wherein the integrated resonator comprises a parallel-coupled capacitance.
3. The integrated circuit of claim 1 , wherein the integrated resonator comprises a series-coupled capacitance.
4. The integrated circuit of claim 1 , wherein each of said first and second connection terminals comprises a bonding pad on a first substrate, and wherein said remote pair of connection terminals comprises a pair of bonding pads on a second substrate.
5. The integrated circuit of claim 3 , wherein the integrated resonator is a floating loop electromagnetically coupled to the transmitter or receiver.
6. A method of providing an integrated circuit with a connection terminal for galvanically isolated signaling, the method comprising:
equipping the integrated circuit with a transmitter or receiver of a modulated carrier signal;
connecting a transfer conductor to the connection terminal;
providing a floating loop integrated resonator laterally adjacent to, and electromagnetically coupled with each of the transfer conductor and the transmitter or receiver, to convey the modulated carrier signal between the transfer conductor and the transmitter or receiver; and
configuring the transmitter to receive a digital signal and to produce pulses in the modulated carrier signal with a first pulse width for rising edges in the digital signal and a second different pulse width for falling edges in the digital signal,
wherein said connection terminal is a first connection terminal, and wherein said connecting includes connecting the first connection terminal to a second connection terminal by the transfer conductor, and wherein the method further comprises: forming a floating transfer loop by electrically connecting the first and second connection terminals to a remote pair of connection terminals which in turn are electrically connected by a remote transfer conductor.
7. The method of claim 6 , wherein the floating resonator has a resonant frequency approximately equal to a carrier frequency of the modulated carrier signal.
8. The method of claim 6 , wherein each of said first and second connection terminals comprises a bonding pad on a first substrate, and wherein said remote pair of connection terminals comprises a pair of bonding pads on a second substrate.