Methods and systems to improve yield in multiple chips integration processes
The present disclosure includes systems and techniques relating to methods and systems that improve yield in multiple chips integration processes. In some implementations, a method includes providing, in a chamber, a first integrated circuit chip and a second integrated circuit chip supported on a carrier, flowing a molding compound to cover the first integrated circuit chip, the second integrated circuit chip, and the carrier; and flowing a forming gas into the chamber while curing the molding compound.
1. A method for minimizing yield losses in multiple chip integration, the method comprising:
providing, in a chamber, a first integrated circuit chip and a second integrated circuit chip supported on a carrier;
flowing a molding compound to cover the first integrated circuit chip, the second integrated circuit chip, and the carrier; and
flowing a forming gas into the chamber while curing the molding compound, wherein the forming gas comprises H 2 .
2. The method of claim 1 , wherein the forming gas further comprises N 2 .
3. An apparatus comprising:
a chamber having a gas outlet port;
a platen positioned within the chamber and configured to support a substrate;
a material introduction port defined through a first opening in the chamber;
a gas introduction port configured to deliver a fully adjustable mixture of gas into the chamber;
a controller configured to determine a mole ratio, a pressure, and a temperature of the fully adjustable mixture of gas to be flowed through the gas introduction port, and
a heater configured to cure a molding compound on the substrate when the fully adjustable mixture of gas is present in the chamber, the molding compound dispensed through the material introduction port.
4. The apparatus of claim 3 , further comprising a first valve and a second valve, each valve being configured to be adjusted based on a control signal from the controller to supply a first amount of a first gas at a first pressure, and a second amount of a second gas at a second pressure, respectively to the gas introduction port.
5. The apparatus of claim 3 , further comprising a heater configured to heat the fully adjustable mixture of gas before it is delivered through the gas introduction port into the chamber.
6. The apparatus of claim 3 , further comprising an actuator configured to translate the platen in three orthogonal directions.
7. The apparatus of claim 3 , further comprising a top cover of the chamber, wherein the material introduction port is formed integrally with the top cover.
8. The apparatus of claim 3 , wherein the gas introduction port comprises a plurality of nozzles arranged in concentric circles about a central nozzle.
9. The apparatus of claim 3 , wherein the gas introduction port has a width that spans a width of the platen.
10. The apparatus of claim 3 , wherein the heater is positioned within the platen.
11. The apparatus of claim 10 , wherein the controller is configured to deliver the fully adjustable mixture of gas through the gas introduction port when the heater is in operation.
12. The apparatus of claim 3 , wherein the material introduction port is a portion of a dispensing device, the dispensing device having an actuator that is configured to translate the introduction port in two perpendicular directions.
13. A method for minimizing yield losses in multiple chip integration, the method comprising:
providing, in a chamber, a first integrated circuit chip and a second integrated circuit chip supported on a carrier;
flowing a molding compound to cover the first integrated circuit chip, the second integrated circuit chip, and the carrier;
determining a mole ratio of H 2 and N 2 in a forming gas; and
flowing the forming gas into the chamber while curing the molding compound.
14. The method of claim 13 , further comprising controlling a pressure of the forming gas in the chamber to increase permeation of the forming gas into a gate oxide and a silicon surface of the first integrated circuit chip.
15. The method of claim 14 , further comprising controlling a temperature of the forming gas to increase permeation of the forming gas into the gate oxide and the silicon surface of the first integrated circuit chip.
16. The method of claim 13 , wherein flowing the forming gas into the chamber comprises introducing the forming gas through a plurality of nozzles defined in a top cover of the chamber.
17. The method of claim 16 , wherein the plurality of nozzles is arranged concentrically about a central nozzle.
18. The method of claim 16 , further comprising adjusting a distance between the plurality of nozzles and the first integrated circuit chip.
19. The method of claim 13 , wherein curing the molding compound occurs at a temperature between 180° C. and 300° C., inclusive.
20. The method of claim 13 , wherein the first integrated circuit chip comprises a dynamic random access memory (DRAM) chip, the second integrated circuit chip comprises a system on chip (SoC), and minimizing yield losses comprises reducing DRAM data retention time degradation.
21. The method of claim 20 , wherein reducing DRAM data retention time degradation comprises reducing a number of broken silicon-to-hydrogen bonds resulting from the curing, by reforming one or more broken bonds using the forming gas.