Method of manufacturing semiconductor device including copper interconnections
Performance of a semiconductor device is improved. In one embodiment, for example, deposition time is increased from 4.6 sec to 6.9 sec. In other words, in one embodiment, thickness of a tantalum nitride film is increased by increasing the deposition time. Specifically, in one embodiment, deposition time is increased such that a tantalum nitride film provided on the bottom of a connection hole to be coupled to a wide interconnection has a thickness within a range from 5 to 10 nm.
1. A method of manufacturing a semiconductor device, comprising the steps of:
(a) forming an interlayer insulating film above a semiconductor substrate;
(b) forming, in the interlayer insulating film, a first interconnection trench integrated with a first connection hole and a second interconnection trench integrated with a second connection hole;
(c) forming a barrier conductor film comprised of a stacked film of a tantalum nitride film and a tantalum film over a region on the interlayer insulating film, the region including each of inner walls of the first interconnection trench and the first connection hole and each of inner walls of the second interconnection trench and the second connection hole; and
(d) after the step (c), forming a copper film over the barrier conductor film so as to fill the first interconnection trench and the first connection hole, and fill the second interconnection trench and the second connection hole; and
(e) after the step (d), while removing the copper film and the barrier conductor film formed over the interlayer insulating film, leaving the copper film and the barrier conductor film in each of insides of the first interconnection trench and the first connection hole, and leaving the copper film and the barrier conductor film in each of insides of the second interconnection trench and the second connection hole,
the step (b) being performed such that width of the first interconnection trench is larger than width of the second interconnection trench, and size of the first connection hole is equal to size of the second connection hole,
the step (c) including the steps of:
(c1) arranging the semiconductor substrate on a stage arranged in a processing chamber; and
(c2) after the step (c1), starting plasma discharge in the processing chamber; and
(c3) after the step (c2), forming the tantalum nitride film over a region on the interlayer insulating film, the region including each of inner walls of the first interconnection trench and the first connection hole and each of inner walls of the second interconnection trench and the second connection hole, by a sputtering process with tantalum as a target and with nitrogen gas introduced into the processing chamber; and
(c4) after exhausting the nitrogen gas, forming the tantalum film over the tantalum nitride film by a sputtering process with tantalum as a target and with a substrate draw bias being applied to the semiconductor substrate,
the step (e) allowing formation of:
a first copper interconnection including the barrier conductor film and the copper film filling the first interconnection trench;
a first copper plug including the barrier conductor film and the copper film filling the first connection hole;
a second copper interconnection including the barrier conductor film and the copper film filling the second interconnection trench; and
a second copper plug including the barrier conductor film and the copper film filling the second connection hole,
wherein deposition time for performing the step (c3) is within a range in which the tantalum nitride film formed on the bottom of the first connection hole has a thickness of 5 to 10 nm.
2. The method according to claim 1 , wherein the tantalum nitride film formed on the bottom of the second connection hole during the deposition time for performing the step (c3) has a thickness of more than 0 nm and 3 nm or less.
3. The method according to claim 1 , wherein the nitrogen gas is introduced into the processing chamber in a step prior to the step (c3).
4. The method according to claim 3 , wherein the nitrogen gas is introduced into the processing chamber in the step (c2).
5. The method according to claim 1 , wherein in the step (c4), the substrate draw bias is applied such that electric potential of the semiconductor substrate is within a range from −350 V to −800 V.
6. The method according to claim 1 , wherein in the step (c4), the substrate draw bias is applied to the semiconductor substrate at a power of 400 to 1000 W.
7. The method according to claim 1 , wherein a resistance value of the first copper plug is lower than a resistance value of the second copper plug.
8. The method according to claim 1 , wherein resistivity of the tantalum film formed on a bottom of the first copper plug is lower than resistivity of the tantalum film formed on a bottom of the second copper plug.
9. The method according to claim 8 , wherein the tantalum film formed on the bottom of the first copper plug has a crystal structure of a α-Ta structure, and the tantalum film formed on the bottom of the second copper plug has a crystal structure of a β-Ta structure.
10. The method according to claim 1 , wherein first thickness of the tantalum nitride film provided on a bottom of the first copper plug is larger than second thickness of the tantalum nitride film provided on a bottom of the second copper plug.
11. A method of manufacturing a semiconductor device, comprising the steps of:
(a) forming an interlayer insulating film above a semiconductor substrate;
(b) forming, in the interlayer insulating film, a first interconnection trench integrated with a first connection hole and a second interconnection trench integrated with a second connection hole;
(c) forming a barrier conductor film comprised of a stacked film of a tantalum nitride film and a tantalum film over a region on the interlayer insulating film, the region including each of inner walls of the first interconnection trench and the first connection hole and each of inner walls of the second interconnection trench and the second connection hole; and
(d) after the step (c), forming a copper film over the barrier conductor film so as to fill the first interconnection trench and the first connection hole, and fill the second interconnection trench and the second connection hole; and
(e) after the step (d), while removing the copper film and the barrier conductor film provided over the interlayer insulating film, leaving the copper film and the barrier conductor film in each of insides of the first interconnection trench and the first connection hole, and leaving the copper film and the barrier conductor film in each of insides of the second interconnection trench and the second connection hole,
the step (b) being performed such that width of the first interconnection trench is larger than width of the second interconnection trench, and size of the first connection hole is equal to size of the second connection hole,
the step (c) including the steps of:
(c1) arranging the semiconductor substrate on a stage arranged in a processing chamber; and
(c2) after the step (c1), starting plasma discharge in the processing chamber; and
(c3) after the step (c2), forming the tantalum nitride film over a region on the interlayer insulating film, the region including each of inner walls of the first interconnection trench and the first connection hole and each of inner walls of the second interconnection trench and the second connection hole by a sputtering process with tantalum as a target and with nitrogen gas introduced into the processing chamber; and
(c4) after exhausting the nitrogen gas, forming the tantalum film over the tantalum nitride film by a sputtering process with tantalum as a target and with a substrate draw bias being applied to the semiconductor substrate,
the step (e) allowing formation of:
a first copper interconnection including the barrier conductor film and the copper film filling the first interconnection trench;
a first copper plug including the barrier conductor film and the copper film filling the first connection hole;
a second copper interconnection including the barrier conductor film and the copper film filling the second interconnection trench; and
a second copper plug including the barrier conductor film and the copper film filling the second connection hole,
wherein, in the step (c4), the substrate draw bias is applied such that electric potential of the semiconductor substrate is within a range from −350 V to −800 V.
12. The method according to claim 11 , wherein power of the substrate draw bias applied in the step (c4) is 400 to 1000 W.
13. The method according to claim 11 , wherein first thickness of the tantalum nitride film provided on a bottom of the first copper plug is larger than second thickness of the tantalum nitride film provided on a bottom of the second copper plug.