INTEGRATED CEILING DEVICE WITH MECHANICAL ARRANGEMENT FOR A LIGHT SOURCE
An integrated ceiling device ( 80, 120 ) includes an electronics assembly ( 56 ) and a mechanical arrangement ( 20 ). The mechanical arrangement includes a housing ( 22 ), a heat dissipating structure ( 24 ), and support arms ( 26 ). The housing is configured to retain the electronics assembly. The heat dissipating structure includes a lamp seat ( 50 ) for receiving a light source ( 54 ), and a central opening ( 34 ) surrounded by fins ( 36 ). The support arms extend between and interconnect the housing with the heat dissipating structure. The housing is positioned within the central opening and is spaced apart from the fins of the heat dissipating structure to enable a free flow of air in an air gap ( 42 ) between the housing ( 22 ) and the structure ( 24 ). The electronics assembly may include a plurality of elements ( 160, 162, 164, 166 ) retained in the housing which are spaced apart from the heat dissipating structure.
1 . An integrated ceiling device comprising:
a mechanical arrangement including:
a housing retaining an electronic assembly;
a heat dissipating structure having a central opening wherein the housing is coupled to the heat dissipating structure to form an air gap extending between the housing and the heat dissipating structure; and
a light source coupled to the heat dissipating structure.
2 . The device of claim 1 , wherein the housing is positioned within the central opening of the heat dissipating structure.
3 . The device of claim 1 , wherein the heat dissipating structure comprises a plurality of fins positioned on the heat dissipating structure.
4 . The device of claim 1 , wherein the heat dissipating structure is ring-shaped.
5 . The device of claim 1 , further comprising support arms extending between and interconnecting the housing and the heat dissipating structure, the support arms providing mechanical support to exterior devices.
6 . The device of claim 1 , wherein an outer surface of the housing comprises a second plurality of fins.
7 . The device of claim 1 , wherein the heat dissipating structure comprises a bottom face coupled to said plurality of fins, wherein the light source is coupled to the bottom face.
8 . The device of claim 7 , further comprising an optical assembly supported by the heat dissipating structure.
9 . The device of claim 8 , wherein the optical assembly comprises a reflector element supported by said heat dissipating structure, the reflector element surrounding the light source.
10 . The device of claim 8 , wherein the optical assembly comprises:
a reflector assembly located at an inner perimeter of said heat dissipating structure; and
a refractor assembly located at an outer perimeter of said heat dissipating structure, the light source being positioned between said reflector assembly and said refractor assembly.
11 . The device of claim 1 , further comprising a selectively removable access cover coupled to the housing for enabling access to the electronics assembly within the housing.
12 . The device of claim 11 , further comprising a selectively removable access cover coupled to the housing for enabling mounting electronics devices on the access cover.
13 . The device of claim 1 , wherein the housing permits free flow of air across its vertical axis.
14 . An integrated ceiling device comprising:
an electronics assembly; and
a mechanical arrangement including:
a housing retaining the electronic assembly;
a heat dissipating structure having a central opening and a plurality of fins positioned on the heat dissipating structure wherein the housing is coupled to the heat dissipating structure and positioned within the central opening of the heat dissipating structure to form an air gap extending between the housing and the heat dissipating structure; and
a light source coupled to the heat dissipating structure.
15 . The device of claim 14 , wherein the heat dissipating structure comprises a plurality of fins positioned on the heat dissipating structure.
16 . The device of claim 14 , wherein the heat dissipating structure is ring-shaped.
17 . The device of claim 14 , wherein the heat dissipating structure comprises a bottom face coupled to said plurality of fins, wherein the light source is coupled to the bottom face.
18 . The device of claim 14 , wherein the housing permits free flow of air across its vertical axis.
19 . An method of using an integrated ceiling device, the method comprising:
coupling an integrated ceiling device to a ceiling, wherein an the integrated ceiling device comprises:
an electronics assembly; and
a mechanical arrangement including:
a housing retaining the electronic assembly;
a heat dissipating structure having a central opening wherein the housing is coupled to the heat dissipating structure to form an air gap extending between the housing and the heat dissipating structure; and
a light source coupled to the heat dissipating structure; and
operating the integrated ceiling device in response to supplying power to the integrated ceiling device; and
cooling the electronics assembly in response to free flow of air flowing through the integrated ceiling device.
20 . The method of claim 19 , further comprising cooling the integrated ceiling device in response to flowing air through the air gap.
21 . The method of claim 19 , further comprising protecting the electronic assembly from moving objects.