Process for encapsulating fragile insulation materials within polyisocyanurate
Embodiments of the present invention are based, at least in part, on the discovery of methods for encapsulating fragile insulation materials within polyisocyanurate foam to thereby provide a construction board having an advantageous balance of insulating properties and mechanical durability.
1. A process for encapsulating insulation devices, the process comprising:
i. providing a plurality of preformed construction boards, where the construction boards are polyisocyanurate foam boards;
ii. placing the construction boards on a conveyor system;
iii. positioning a plurality of insulation devices directly on each of the polyisocyanurate foam boards in a manner that provides interstices between the insulation devices and in a manner where at least 80% of the surface area of each construction board is covered by the insulation devices;
iv. providing a developing foam by mixing an isocyanate-containing compound with an isocyanate-reactive compound, where the amount of isocyanate-containing compound to isocyanate-reactive compound is set to provide a foam product with an ISO index of at least 190;
v. depositing the developing foam directly over an upper surface of the insulation devices to at least partially cover the insulation devices and to at least partially fill the interstices between the respective insulation devices and at least partially mate the developing foam with each of the construction boards;
vi. applying a facer over said developing foam to thereby form a continuous composite including the developing foam;
vii. placing the continuous composite into a laminator, where the continuous composite is thereby heated within the laminator to promote curing of the developing foam and provide a continuous foamed product; and
viii. cutting the continuous foamed product to a desired length to thereby form a composite board.
2. The process of claim 1 , further comprising the step of adhering the plurality of insulation devices to the construction boards.
3. The process of claim 1 , further comprising the step of applying an adhesive to the insulation devices, the construction boards, or both the insulation devices and the construction boards prior to said step of positioning.
4. The process of claim 1 , where said step of positioning and said step of depositing take place continuously within an integrated process.
5. The process of claim 1 , where the amount of isocyanate-containing compound to isocyanate-reactive compound is set to provide a foam product with an ISO index of at least 220.
6. The process of claim 1 , where the polyisocyanurate foam boards have a density of less than 2.5 pounds per cubic foot.
7. The process of claim 1 , where the polyisocyanurate foam boards have a density of greater than 2.5 pounds per cubic foot.
8. The process of claim 1 , where the polyisocyanurate foam boards have a density of greater than 3.0 pounds per cubic foot.