Thermally conductive silicone composition and electrical/electronic apparatus
Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.
1. A thermally conductive silicone composition comprising:
(A) 100 parts by mass of either;
i) (a1) an organopolysiloxane having, in each molecule thereof, an average of at least 0.5 alkenyl groups and at least one alkoxysilyl-containing group bonded to a silicon atom of a polysiloxane backbone of the (a1) organopolysiloxane and expressed by the general formula:
where the R 1 groups represent identical or different monovalent hydrocarbon groups having no aliphatic unsaturated bond, the R 2 group represents an alkyl group, the R 3 groups represent identical or different alkylene groups, a represents an integer from 0 to 2, and p represents an integer from 1 to 50, or
ii) a mixture of component (a1) and (a2) an organopolysiloxane having, in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group, where the amount of component (a1) contained in the mixture is 10 to less than 100 mass %; and
(B) 400 to 3,500 parts by mass of a thermally conductive filler.
2. The thermally conductive silicone composition according to claim 1 , wherein the alkoxysilyl-containing group in component (A) is a group expressed by the following formula:
3. The thermally conductive silicone composition according to claim 1 , wherein the average particle diameter of component (B) is from 0.01 to 100 μm.
4. The thermally conductive silicone composition according to claim 1 , wherein component (B) is a metal-based powder, a metal oxide-based powder, a metal nitride-based powder, or a carbon powder.
5. The thermally conductive silicone composition according to claim 1 , wherein component (B) is silver powder, aluminum powder, aluminum oxide powder, zinc oxide powder, aluminum nitride powder, or graphite.
6. The thermally conductive silicone composition according to claim 1 , wherein component (B) is (B1) boron nitride powder in plate form having an average particle diameter of from 0.1 to 30 μm, (B2) boron nitride powder in granular form having an average particle diameter of from 0.1 to 50 μm, (B3) aluminum oxide powder in spherical form and/or pulverized form having an average particle diameter of from 0.01 to 50 μm, or (B4) graphite having an average particle diameter of from 0.01 to 50 μm, or a mixture of two or more types thereof.
7. The thermally conductive silicone composition according to claim 1 , which is a thermally conductive silicone grease composition.
8. The thermally conductive silicone composition according to claim 1 , which is a curable thermally conductive silicone composition.
9. An electrical/electronic apparatus provided with the thermally conductive silicone composition according to claim 1 .
10. A heat dissipation member for an electrical/electronic apparatus, the heat dissipation member comprising the thermally conductive silicone composition according to claim 1 .
11. The thermally conductive silicone composition according to 1 , wherein component (a1) has at least two of the alkoxysilyl-containing groups.
12. The thermally conductive silicone composition according to 1 , wherein component (a1) comprises a straight chain organopolysiloxane having the alkoxysilyl-containing groups bonded to silicon atoms at both termini of the molecular chain.
13. The thermally conductive silicone composition according to 1 , wherein component (B) comprises aluminum oxide powder.
14. The thermally conductive silicone composition according to 7 , which is free of a curing catalyst.
15. The thermally conductive silicone composition according to 8 , further comprising (C) a curing catalyst.
16. The thermally conductive silicone composition according to 1 , wherein component (a1) has an average of at least 0.5 and not more than 20 alkenyl groups.
17. The thermally conductive silicone composition according to 1 , further comprising (a3) an organopolysiloxane having, in each molecule thereof, at least two silicon atom bonded hydrogen atoms.
18. The thermally conductive silicone composition according to 1 , further comprising (D) a silica-based filler, (E) a coupling agent, or a combination thereof.
19. A curable thermally conductive silicone composition comprising:
(A) either;
i) (a1) an organopolysiloxane having, in each molecule thereof, an average of at least 0.5 alkenyl groups and at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula:
where the R 1 groups represent identical or different monovalent hydrocarbon groups having no aliphatic unsaturated bond, the R 2 group represents an alkyl group, the R 3 groups represent identical or different alkylene groups, a represents an integer from 0 to 2, and p represents an integer from 1 to 50, or
ii) a mixture of component (a1) and (a2) an organopolysiloxane having, in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group, where the amount of component (a1) contained in the mixture is 10 to less than 100 mass %; and
(B) a thermally conductive filler.
20. The thermally conductive silicone composition according to claim 1 , wherein the polysiloxane backbone of component (a1) is free from alkylene groups other than those present in the alkoxysilyl-containing group.