Adhesion promoter and curable organopolysiloxane composition containing same
An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.
1. A hydrosilylation curable organopolysiloxane composition comprising an adhesion promoter, the adhesion promoter comprising:
(A) 100 mass parts of a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group, the reaction mixture comprising a carbasilatrane derivative expressed by the general formula:
where R 1 represents an alkyl group or an alkoxy group, R 2 represents the same or different group having the general formula:
where R 4 represents an alkylene group or an alkylenoxyalkylene group, R 5 represents a monovalent hydrocarbon group, R 6 represents an alkyl group, and a represents 0, 1, or 2, and R 3 represents the same or different hydrogen atom or alkyl group;
(B) 10 to 800 mass parts of a disilalkane expressed by the general formula:
where R C represents a substituted or unsubstituted alkylene group with 2 to 20 carbon atoms, R D each independently represent an alkyl group or an alkoxyalkyl group, R E each independently represent a monovalent hydrocarbon group, and b each independently represent 0 or 1; and
(C) 10 to 800 mass parts of a silane having an epoxy group expressed by the general formula: R a n Si(OR b ) 4-n where R a represents an organic group having a monovalent epoxy group, R b represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents a number within a range of 1 to 3, or a partially hydrolyzed condensate thereof.
2. The hydrosilylation curable organopolysiloxane composition according to claim 1 , wherein component (C) is a trialkoxysilane having an epoxy group expressed by the following general formula:
where R a1 represents a hydrogen atom or an alkyl group with 1 to 10 carbon atoms, R a2 represents an alkylene group or an alkyleneoxyalkylene group with 1 to 10 carbon atoms, and R b1 represents an alkyl group with 1 to 10 carbon atoms.
3. The hydrosilylation curable organopolysiloxane composition according to claim 1 , further comprising (D) a hydrosilylation reaction catalyst.
4. The hydrosilylation curable organopolysiloxane composition according to claim 3 , further comprising (E) an organopolysiloxane having in a molecule at least one alkoxysilyl containing group expressed by the following general formula:
where R F each represent the same or different monovalent hydrocarbon group without an aliphatic unsaturated bond, R G represents an alkyl group, R H each represent the same or different alkylene group, q represents an integer from 0 to 2, and p represents an integer from 1 to 50.
5. The hydrosilylation curable organopolysiloxane composition according to claim 4 , further comprising (F) at least one type of reinforcing filler selected from the group consisting of fumed silica fine powder, precipitated silica dine powder, pyrogenic silica fine powder, fumed titanium oxide fine powder, and quartz fine powder.
6. The hydrosilylation curable organopolysiloxane composition according to claim 1 , which is room temperature curable.
7. A protective agent or adhesive composition for electric and electronic components, comprising the hydrosilylation curable organopolysiloxane composition according to claim 1 .
8. The hydrosilylation curable organopolysiloxane composition according to claim 3 , further comprising:
(G1) an organopolysiloxane having at least two alkenyl groups in the molecule; and
(G2) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule.
9. An electric or electronic apparatus, comprising an electric or electronic component that is enclosed or sealed by the protective agent or adhesive composition according to claim 7 .
10. The hydrosilylation curable organopolysiloxane composition according to claim 8 , further comprising a cure inhibiting agent.
11. A hydrosilylation curable organopolysiloxane composition comprising an adhesion promoter, the adhesion promoter comprising:
(A) a carbasilatrane derivative having the structure
(B) a disilalkane expressed by the general formula:
where R C represents a substituted or unsubstituted alkylene group with 2 to 20 carbon atoms, R D each independently represent an alkyl group or an alkoxyalkyl group, R E each independently represent a monovalent hydrocarbon group, and b each independently represent 0 or 1; and
(C) a silane having an epoxy group expressed by the general formula: R a n Si(OR b ) 4-n where R a represents an organic group having a monovalent epoxy group, R b represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents a number within a range of 1 to 3, or a partially hydrolyzed condensate thereof.
12. The hydrosilylation curable organopolysiloxane composition according to claim 11 , wherein with respect to the adhesion promotor: component (A) is present in 100 mass parts, component (B) is present in 30 to 266 mass parts, and component (C) is present in 50 to 333 mass parts.
13. A method of preparing the hydrosilylation curable organopolysiloxane composition according to claim 1 , said method comprising:
1) reacting an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group to obtain component (A); and
2) mixing 100 mass parts of component (A) with
i) 10 to 800 mass parts of component (B), and
ii) 10 to 800 mass parts of component (C).
14. The method according to claim 13 , wherein component (C) is a trialkoxysilane having an epoxy group expressed by the following general formula:
where R a1 represents a hydrogen atom or an alkyl group with 1 to 10 carbon atoms, R a2 represents an alkylene group or an alkyleneoxyalkylene group with 1 to 10 carbon atoms, and R b1 represents an alkyl group with 1 to 10 carbon atoms.
15. The method according to claim 13 , wherein the organoalkoxysilane having an amino group is 3-aminopropyltrimethoxysilane and the organoalkoxysilane having an epoxy group is 3-glycidoxypropyl trimethoxysilane such that component (A) comprises a carbasilatrane derivative having the structure
16. The method according to claim 13 , wherein the organoalkoxysilane having an amino group and the organoalkoxysilane having an epoxy group are reacted in a molar ratio within a range of 1:1.15 to 1:5.
17. The method according to claim 13 , further defined as a method of preparing a protective agent or adhesive composition, wherein step 2) further comprises mixing 100 mass parts of component (A) with (G) a curable organopolysiloxane composition.
18. The method according to claim 17 , wherein step 2) further comprises mixing 100 parts by mass of component (A) with at least one component selected from the group of:
(D) a catalyst selected from the group consisting of a hydrosilylation reaction catalyst, a condensation reaction catalyst, or a mixture thereof;
(E) an organopolysiloxane having in a molecule at least one alkoxysilyl containing group expressed by the following general formula:
where R F each represent the same or different monovalent hydrocarbon group without an aliphatic unsaturated bond, R G represents an alkyl group, R H each represent the same or different alkylene group, q represents an integer from 0 to 2, and p represents an integer from 1 to 50; and
(F) a reinforcing filler.